ISPLSI2032VE180LB49 LATTICE [Lattice Semiconductor], ISPLSI2032VE180LB49 Datasheet

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ISPLSI2032VE180LB49

Manufacturer Part Number
ISPLSI2032VE180LB49
Description
Manufacturer
LATTICE [Lattice Semiconductor]
Datasheet
• SuperFAST HIGH DENSITY IN-SYSTEM
• 3.3V LOW VOLTAGE 2032 ARCHITECTURE
• HIGH PERFORMANCE E
• IN-SYSTEM PROGRAMMABLE
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE
• THE EASE OF USE AND FAST SYSTEM SPEED OF
Copyright © 2006 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
2032ve_11
Features
PROGRAMMABLE LOGIC
— 1000 PLD Gates
— 32 I/O Pins, Two Dedicated Inputs
— 32 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
— Small Logic Block Size for Random Logic
— 100% Functional, JEDEC and Pinout Compatible
— Interfaces With Standard 5V TTL Devices
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
— 3.3V In-System Programmability Using Boundary
— Open-Drain Output Option for Flexible Bus Interface
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Prototyping
PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAs
— Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
— Lead-Free Package Options
Machines, Address Decoders, etc.
with ispLSI 2032V Devices
f
t
Scan Test Access Port (TAP)
Capability, Allowing Easy Implementation of
Wired-OR or Bus Arbitration Logic
Market and Improved Product Quality
Interconnectivity
max = 300 MHz Maximum Operating Frequency
pd = 3.0 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
The ispLSI 2032VE is a High Density Programmable
Logic Device that can be used in both 3.3V and 5V
systems. The device contains 32 Registers, 32 Universal
I/O pins, two Dedicated Input Pins, three Dedicated
Clock Input Pins, one dedicated Global OE input pin and
a Global Routing
complete interconnectivity between all of these elements.
The ispLSI 2032VE features in-system programmability
through the Boundary Scan Test Access Port (TAP) and
is 100% IEEE 1149.1 Boundary Scan Testable. The
ispLSI 2032VE offers non-volatile reprogrammability of
the logic, as well as the interconnect to provide truly
reconfigurable systems.
The basic unit of logic on the ispLSI 2032VE device is the
Generic Logic Block (GLB). The GLBs are labeled A0, A1
.. A7 (see Figure 1). There are a total of eight GLBs in the
ispLSI 2032VE device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
Functional Block Diagram
Description
A0
A1
A2
A3
High Density SuperFAST™ PLD
GLB
ispLSI
3.3V In-System Programmable
Pool (GRP).
Global Routing Pool
Logic
Array
(GRP)
D Q
D Q
D Q
D Q
®
2032VE
The GRP provides
August 2006
A6
A5
A4
A7
0139Bisp/2000

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ISPLSI2032VE180LB49 Summary of contents

Page 1

Features • SuperFAST HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 1000 PLD Gates — 32 I/O Pins, Two Dedicated Inputs — 32 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. — ...

Page 2

Functional Block Diagram Figure 1. ispLSI 2032VE Functional Block Diagram GOE 0 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 ...

Page 3

Absolute Maximum Ratings Supply Voltage V .................................. -0.5 to +5.4V cc Input Voltage Applied ............................... -0.5 to +5.6V Off-State Output Voltage Applied ............ -0.5 to +5.6V Storage Temperature .............................. -65 to +150°C Case Temp. with Power Applied .............. -55 to ...

Page 4

Switching Test Conditions Input Pulse Levels Input Rise and Fall Time 10% to 90% Input Timing Reference Levels Output Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. Output Load Conditions (see Figure 2) TEST ...

Page 5

External Timing Parameters 3 TEST PARAMETER # COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay pd2 f max A 3 Clock Frequency with Internal Feedback f – 4 Clock Frequency ...

Page 6

External Timing Parameters 3 TEST PARAMETER # COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay pd2 f max A 3 Clock Frequency with Internal Feedback f – 4 Clock Frequency ...

Page 7

Internal Timing Parameters 2 PARAMETER # Inputs t 20 Input Buffer Delay Dedicated Input Delay din GRP t 22 GRP Delay grp GLB Product Term Bypass Path Delay (Combinatorial) 4ptbpc Product ...

Page 8

Internal Timing Parameters 2 PARAMETER # Inputs t 20 Input Buffer Delay Dedicated Input Delay din GRP t grp 22 GRP Delay GLB Product Term Bypass Path Delay (Combinatorial) 4ptbpc t 4ptbpr 24 4 ...

Page 9

Timing Model I/O Cell Ded. In #21 I/O Delay I/O Pin #20 (Input) #45 Reset Y0,1,2 GOE Derivations of su, h and co from the Product Term Clock Logic + Reg ...

Page 10

Power Consumption Power consumption in the ispLSI 2032VE device de- pends on two primary factors: the speed at which the device is operating and the number of product terms Figure 3. Typical Device Power Consumption vs fmax 150 125 100 ...

Page 11

Signal Descriptions Signal Name GOE 0 Global Output Enable input pin Y0 Dedicated Clock input. This clock input is connected to one of the clock inputs of all the GLBs in the device. RESET/Y1 This pin performs two functions: (1) ...

Page 12

Pin Configuration ispLSI 2032VE 44-Pin TQFP Pinout Diagram (0.8mm Lead Pitch/10.0 x 10.0mm Body Size) I/O 28 I/O 29 I VCC BSCAN TDI/IN 0 I/O 0 I pins are not to ...

Page 13

Pin Configuration ispLSI 2032VE 48-Pin TQFP Pinout Diagram (0.5mm Lead Pitch/7.0 x 7.0mm Body Size) I/O 28 I/O 29 I/O 30 I/O 31 VCC BSCAN 1 TDI/IN 0 I/O 0 I Pins have dual ...

Page 14

Part Number Description ispLSI 2032VE – XXX Device Family Device Number 2032VE Speed f 300 = 300 MHz max f 225 = 225 MHz max f 180 = 180 MHz max f 135 = 135 MHz max f 110 = ...

Page 15

Ordering Information (Cont.) Lead-Free Packaging FAMILY fmax (MHz) tpd (ns) 300 300 180 180 ispLSI 135 135 110 110 FAMILY fmax (MHz) tpd (ns) ispLSI 180 Revision History Date Version — 10 August 2006 11 Specifications ispLSI 2032VE ...

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