HCS112D Intersil Corporation, HCS112D Datasheet - Page 3

• Manufacturer Part Number: HCS112D
• Description: Radiation Hardened Dual JK Flip-Flop
• Manufacturer: Intersil Corporation

Absolute Maximum Ratings
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input
DC Drain Current, Any One Output
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . . . . . . -65
Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent
damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed
under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation.
Operating Conditions
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range (T
Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . 100ns/V Max
NOTES:
1. All voltages referenced to device GND.
2. Force/Measure Functions may be interchanged.
3. For functional tests, VO
Supply Current
Output Current
(Sink)
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage
Current
Noise Immunity
Functional Test
PARAMETER
SYMBOL
VOH
VOL
IOH
ICC
IOL
IIN
FN
4.0V is recognized as a logic “1”, and VO
A
) . . . . . . . . . . . . -55
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
VCC = 5.5V,
VIN = VCC or GND
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V,
(Note 2)
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC - 0.4V,
VIL = 0V, (Note 2)
VCC = 5.5V, VIH = 3.85V,
IOL = 50 A, VIL = 1.65V
VCC = 4.5V, VIH = 3.15V,
IOL = 50 A, VIL = 1.35V
IOH = -50 A, VIL = 1.65V
VCC = 4.5V, VIH = 3.15V,
IOH = -50 A, VIL = 1.35V
VCC = 5.5V, VIN = VCC or
GND
VCC = 4.5V, VIH = 3.15V,
VIL = 1.35V (Note 3)
VCC = 5.5V, VIH = 3.85V,
CONDITIONS
(NOTE 1)
Specifications HCS112MS
o
o
C to +150
C to +125
10mA
25mA
o
o
o
o
C
C
C
C
13
GROUPS
7, 8A, 8B
GROUP
A SUB-
Reliability Information
Thermal Resistance
Maximum Package Power Dissipation at +125
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . VCC to 70% of VCC
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . 0.0V to 30% of VCC
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
2, 3
2, 3
2, 3
2, 3
SBDIP Package. . . . . . . . . . . . . . . . . . . .
Ceramic Flatpack Package . . . . . . . . . . .
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.68W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.44W
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.7mW/
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 8.8mW/
1
1
1
1
0.5V is recognized as a logic “0”.
+25
+25
+25
+25
+25
TEMPERATURE
+125
+125
+125
o
o
o
o
+125
o
C, +125
C, +125
C, +125
C, +125
C, +125
+25
+25
+25
+25
o
o
o
o
C, -55
C, -55
C, -55
C, -55
o
o
o
o
o
o
o
o
o
C
C
C
C
C, -55
C, -55
C, -55
C, -55
C, -55
o
o
o
o
C
C
C
C
o
o
o
o
o
C
C
C
C
C
VCC
VCC
MIN
-4.8
-4.0
-0.1
-0.1
4.8
4.0
Spec Number
-
-
-
-
-
LIMITS
o
114
73
C Ambient
o
o
MAX
JA
C/W
400
C/W
0.1
0.1
20
0.5
5.0
-
-
-
-
-
-
-
24
29
UNITS
518830
mA
mA
mA
mA
o
o
V
V
V
V
JC
C/W
C/W
-
A
A
A
A
o
o
C
C