BS62LV8000 Brilliance Semiconductor, BS62LV8000 Datasheet
BS62LV8000
Related parts for BS62LV8000
BS62LV8000 Summary of contents
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... HIGH chip enable(CE2) and active LOW output enable (OE) and three-state output drivers. The BS62LV8000 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS62LV8000 is available in 44 pin TSOP2 and 48-pin BGA type. SPEED Vcc ( ns ) ...
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... OPERATING RANGE RATING UNITS -0 Vcc+0.5 Commercial O -40 to +125 C O -60 to +150 C 1.0 W CAPACITANCE 20 mA SYMBOL This parameter is guaranteed and not tested. 2 BS62LV8000 Function I/O OPERATION Vcc CURRENT High Z High Z D OUT D IN AMBIENT RANGE TEMPERATURE + Industrial - +85 O ...
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... IN IN See Retention Waveform ( CE1 Controlled ) Data Retention Mode ≥ V 1.5V DR Vcc t CDR ≥ CE1 Vcc - 0. CE2 Controlled ) Data Retention Mode V 1.5V DR Vcc t CDR CE2 0. BS62LV8000 (1) MIN. TYP. MAX. -0.5 -- Vcc=3V -0.5 -- Vcc=5V 2.0 -- Vcc+0.2 Vcc=3V 2.2 -- Vcc+0.2 Vcc= Vcc= Vcc=5V Vcc=3V 2.4 ...
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... Output Disable to Output Address Change 4 BS62LV8000 KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS MUST BE STEADY MAY CHANGE FROM MAY CHANGE FROM DON T CAR E: ANY CHANG E PERMITTED DOES NOT APPLY Vcc = 3V ) BS62LV8000-70 BS62LV8000-10 MIN. TYP. MAX. MIN. TYP. MAX 100 -- -- ...
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... The parameter is guaranteed but not 100% tested. R0201-BS62LV8000 ) ACS2 t ACS1 (5) t CLZ ACS2 t OLZ t ACS1 (5) t CLZ . and CE2 = 5pF as shown in Figure 1B BS62LV8000 t OH (5) t CHZ (5) OHZ (1,5) t CHZ Revision 2.4 April 2002 ...
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... Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active t WC (5) (11 ( (4,10) t OHZ 6 BS62LV8000 Vcc = 3.0V ) BS62LV8000-70 BS62LV8000-10 MIN. TYP. MAX. MIN. TYP. MAX 100 -- 100 -- 100 -- 35 -- ...
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... CE2 going high or CE1 going low to the end of write. CW R0201-BS62LV8000 ( (4,10) t WHZ ). IL ± 500mV from steady state with BS62LV8000 (11 ( (8, 5pF as shown in Figure 1B. (8) Revision 2.4 April 2002 ...
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... BSI ORDERING INFORMATION BS62LV8000 PACKAGE DIMENSIONS TSOP2-44 R0201-BS62LV8000 BS62LV8000 SPEED 70: 70ns 10: 100ns GRADE + - + PACKAGE E: TSOP2-44 B: BGA-48-0810 Revision 2.4 April 2002 ...
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... BSI PACKAGE DIMENSIONS (continued) SIDE VIEW D 0.1 D1 VIEW A 48 mini-BGA (8 x 10mm) R0201-BS62LV8000 NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS 10.0 8.0 9 BS62LV8000 5.25 3.75 0.75 SOLDER BALL 0.35 0.05 Revision 2.4 April 2002 ...
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... BSI REVISION HISTORY Revision Description 2.2 2001 Data Sheet release 2.3 Modify Standby Current (Typ. and Max.) 2.4 Modify some AC parameters. Modify 5V ICCSB1_Max(I-grade) from 50uA to 100uA. R0201-BS62LV8000 Date Apr. 15, 2001 Jun. 29, 2001 April,11,2002 10 BS62LV8000 Note Revision 2.4 April 2002 ...