MSM7702 OKI electronic componets, MSM7702 Datasheet - Page 16

• Manufacturer Part Number: MSM7702
• Description: Single Rail CODEC
• Manufacturer: OKI electronic componets

PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
¡ Semiconductor
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
MSM7702-01/02/03
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
(Unit : mm)
16/17