LDH54xxxx Murata Manufacturing, LDH54xxxx Datasheet - Page 8

• Manufacturer Part Number: LDH54xxxx
• Description: (LDH Series) Chip Multilayer Delay Lines
• Manufacturer: Murata Manufacturing

1
!Note
!Note
1. Standard PCB Design (Land Pattern and Dimensions):
2. Soldering Conditions:
o Soldering iron method conditions are indicated below.
1. Be careful in handling or transporting products
2. Handle with care. If products are cracked or have
8
Notice
because excessive stress or mechanical shock may
break products due to the nature of ceramics
structure.
damaged terminals, their characteristics may
change.
Do not touch products with bare hands. Poor
solderability may result.
Notice (Soldering and Mounting)
Notice (Handling)
All the ground terminals should be connected to the
ground patterns. Please refer to specifications for
standard land dimensions.
The recommended land pattern and dimensions is as
Murata's standard. The characteristics of products may
vary depending on the pattern drawing method,
grounding method, land dimensions and the PCB
material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-
standard lands, contact Murata beforehand.
Carefully perform preheating so that the temperature
difference ( T) between the solder and products surface
should be in the following range. When products are
immersed in solvent after mounting, pay special attention
to maintain the temperature difference within 100 C.
Soldering must be carried out by the above mentioned
conditions to prevent products from damage.
If other soldering conditions exist, please contact Murata
before use.
Item
Soldering iron wattage
Temperature of iron-tip
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
Soldering iron method
Soldering method
Reflow method
Kind of iron
Nichrome heater
V280 C
V30W
Temperature
TV130 C
Ceramics heater
V250 C
V18W
3. Notice for Chip Placement
When the products are placed on the PCB, they may
be stressed and broken by uneven forces from a
wornout chucking locator claw or suction device.
To prevent damage to products, be sure to follow
the maintenance specifications for the chip placer.
Be aware that mechanical chucking may damage
products when positioning them on the PCB.
o Diameter of iron-tip : f3.0 mm max.
o Do not allow the iron-tip to directly touch the ceramic
Use rosin type flux or weakly active flux with a chlorine
content of 0.2 wt % or less.
Use eutectic crystal solder.
Amount of Solder Paste:
o Ensure that solder is applied smoothly to a minimum
element.
insufficient, creating the variation of characteristics.
height of 0.2 to 0.5 mm at the end surface of the external
electrodes. If too much or little solder is applied, there is
high possibility that the mechanical strength will be
Reflow soldering standard conditions (Example)
Pre-heating
60sec. min.
within 120sec.
within 20—40sec.
within 10sec.
220—230 C
200 C
Time (sec.)
N91E7.pdf 03.5.13