UPG175TA-E3 NEC, UPG175TA-E3 Datasheet

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UPG175TA-E3

Manufacturer Part Number
UPG175TA-E3
Description
L-Band PA DRIVER AMPLIFIER
Manufacturer
NEC
Datasheet
Document No. P13470EJ1V0DS00 (1st edition)
Date Published May 1998 N CP(K)
Printed in Japan
DESCRIPTION
(Personal Digital Cellular in Japan) and another L-band application. The device can operate with 3.0 V, having the
high gain and low distortion.
FEATURES
• Low Operation Voltage: V
• f
• Low distortion: P
• Low operation Current: I
• Variable gain control function:
• 6 pin mini-mold package
APPLICATION
• Digital Cellular: PDC800M, etc.
ORDERING INFORMATION (PLAN)
PG175TA-E3
External input and output matching
External input and output matching
Remark For sample order, please contact your local NEC sales office. (Part number for sample order:
Caution The IC must be handled with care to prevent static discharge because its circuit composed of
PART NUMBER
RF
PG175TA is a GaAs MMIC for PA driver amplifier with variable gain function which was developed for PDC
: 925 to 960 MHz@ P
GaAs HJ-FET.
adj1
6 pin Mini-mold
= –60 dBc typ. @ V
The information in this document is subject to change without notice.
out
DD
PRELIMINARY DATA SHEET
DD1
L-Band PA DRIVER AMPLIFIER
= +9 dBm
= 20 mA typ. @ V
PACKAGE
= V
G = 35 dB typ. @ V
DD2
= 3.0 V
DD
= 3.0 V, P
DD
= 3.0 V, P
Carrier tape width is 8 mm, Quantity is 3 kpcs per reel.
AGC
out
= +9 dBm, V
= 0.5 to 2.5 V
out
GaAs INTEGRATED CIRCUIT
= +9 dBm, V
AGC
= 2.5 V
AGC
PACKING FORM
= 2.5 V
PG175TA
©
PG175TA)
1998

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UPG175TA-E3 Summary of contents

Page 1

... PART NUMBER PG175TA-E3 6 pin Mini-mold Remark For sample order, please contact your local NEC sales office. (Part number for sample order: Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET. The information in this document is subject to change without notice. ...

Page 2

... AGC Input Power P in Total Power Dissipation P tot Operating Temperature T A Storage Temperature T stg Note Mounted 1.6 mm double copper clad epoxy glass PWB, T PIN CONNECTION AND INTERNAL BLOCK DIAGRAM PIN NO. CONNECTION PIN NO DD1 2 GND & OUT 6 DD2 ...

Page 3

ELECTRICAL CHARACTERISTICS (Unless otherwise specified 25° External input and output matching) PARAMETERS SYMBOL Operating Frequency f Total Current I DD AGC Control Current I AGC Power Gain G p Variable Gain Range G Adjacent Channel Power ...

Page 4

... EVALUATION CIRCUIT (Preliminary +3 950 MHz DD1 DD2 L1 IN Using the NEC Evaluation board C1 2.0 pF C2, C3 1000 DD1 DD2 G1E Preliminary Data Sheet PG175TA OUT ...

Page 5

EVALUATION BOARD (Epoxy Glass, = 4.6, 0.4 mm thickness) V DD1 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm 0.13 +0.1 0.3 –0 ...

Page 6

RECOMMENDED SOLDERING CONDITIONS This Product should be soldered in the following recommended conditions. conditions than the recommended conditions are to be consulted with our sales representatives. Soldering process Infrared ray reflow Package peak temperature: 235°C Hour: within 30 s. (more ...

Page 7

Preliminary Data Sheet PG175TA 7 ...

Page 8

... Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance ...

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