K7A801809B Samsung semiconductor, K7A801809B Datasheet

no-image

K7A801809B

Manufacturer Part Number
K7A801809B
Description
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM
Manufacturer
Samsung semiconductor
Datasheet
K7A803601M
K7A801801M
Document Title
Revision History
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM
Rev. No.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
1.0
2.0
3.0
History
Initial draft
Modify DC characteristics( Input Leakage Current test Conditions)
form V
Remove 119BGA Package Type.
Change DC Characteristics.
I
I
I
I
I
1. Changed t
2. Changed DC condition at Icc and parameters
A
Changed V
Final spec Release.
1. Remove V
1. Add V
SB
SB
SB
SB1
SB2
DD
Icc ; from 375mA to 400mA at -72,
I
Changed t
SB
value from 65mA to 110mA at -72
value from 60mA to 110mA at -85
value from 50mA to 100mA at -10
value from 10mA to 30mA
value from 10mA to 30mA
V
DD
; from 110mA to 130mA at -72,
DDQ
from 340mA to 380mA at -85,
from 300mA to 350mA at -10,
from 110mA to 130mA at -85,
from 100mA to 120mA at -10
=V
DDQ
Supply voltage( 2.5V )
OL
SS
CD
OE
DDQ
Supply voltage( 2.5V I/O )
Max value from 0.2V to 0.4V at 2.5V I/O.
to V
from 4.0ns to 4.2ns at -85.
from 4.0ns to 4.2ns at -85.
Supply voltage( 2.5V I/O )
DD
to Max.
256Kx36 & 512Kx18 Synchronous SRAM
- 1 -
Draft Date
May. 07 . 1998
June .08. 1998
Aug. 20. 1998
Aug. 27. 1998
Sep. 09. 1998
Dec. 10. 1998
Dec. 23. 1998
Jan. 29. 1999
Feb. 25. 1999
May. 13. 1999
Remark
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
Final
May 1999
Rev 3.0

Related parts for K7A801809B

K7A801809B Summary of contents

Page 1

... K7A803601M K7A801801M Document Title 256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM Revision History Rev. No. History 0.0 Initial draft 0.1 Modify DC characteristics( Input Leakage Current test Conditions) form Max 0.2 Remove 119BGA Package Type. 0.3 Change DC Characteristics. I value from 65mA to 110mA at - value from 60mA to 110mA at -85 ...

Page 2

... K7A803601M K7A801801M 256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM FEATURES • Synchronous Operation. • 2 Stage Pipelined operation with 4 Burst. • On-Chip Address Counter. • Self-Timed Write Cycle. • On-Chip Address and Control Registers. • 3.3V+0.165V/-0.165V Power Supply. • I/O Supply Voltage 3.3V+0.165V/-0.165V for 3.3V I/O or 2.5V+0.4V/-0.125V for 2.5V I/O • ...

Page 3

... The pin 42 is reserved for address bit for the 16Mb . 256Kx36 & 512Kx18 Synchronous SRAM 100 Pin TQFP (20mm x 14mm) K7A803601M(256Kx36) TQFP PIN NO. ...

Page 4

... The pin 42 is reserved for address bit for the 16Mb . 256Kx36 & 512Kx18 Synchronous SRAM 100 Pin TQFP (20mm x 14mm) K7A801801M(512Kx18) TQFP PIN NO. ...

Page 5

... The accesses are enabled with the chip select signals and output enabled signals. Wait states are inserted into the access with ADV. When ZZ is pulled high, the SRAM will enter a Power Down State. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM normally operates after 2cycles of wake up time ...

Page 6

... Note : 1. X means "Don t Care". 2. All inputs in this table must meet setup and hold time around the rising edge of CLK( ). 256Kx36 & 512Kx18 Synchronous SRAM WRITE CLK ADDRESS ACCESSED ...

Page 7

... DDQ Ground V CAPACITANCE* (T =25 C, f=1MHz) A PARAMETER SYMBOL Input Capacitance C Output Capacitance C *Note : Sampled not 100% tested. 256Kx36 & 512Kx18 Synchronous SRAM PRESENT CYCLE OPERATION CS WRITE 1 Initiate Read Cycle Address=An L Data=Qn-1 for all bytes No new cycle H Data=Qn-1 for all bytes No new cycle ...

Page 8

... Input Rise and Fall Time(Measured at 20% to 80% for 3.3V I/O) Input Rise and Fall Time(Measured at 20% to 80% for 2.5V I/O) Input and Output Timing Reference Levels for 3.3V I/O Input and Output Timing Reference Levels for 2.5V I/O Output Load 256Kx36 & 512Kx18 Synchronous SRAM (V =3.3V+0.165V/-0.165V TEST CONDITIONS V =Max ...

Page 9

... Both chip selects must be active whenever ADSC or ADSP is sampled low in order for the this device to remain enabled. 3. ADSC or ADSP must not be asserted for at least 2 Clock after leaving ZZ state any given voltage and temperature, t 256Kx36 & 512Kx18 Synchronous SRAM Output Load(B), (for t RL=50 VL=1 ...

Page 10

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 10 - May 1999 Rev 3.0 ...

Page 11

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 11 - May 1999 Rev 3.0 ...

Page 12

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 12 - May 1999 Rev 3.0 ...

Page 13

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 13 - May 1999 Rev 3.0 ...

Page 14

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 14 - May 1999 Rev 3.0 ...

Page 15

... K7A803601M K7A801801M APPLICATION INFORMATION DEPTH EXPANSION The Samsung 256Kx36 Synchronous Pipelined Burst SRAM has two additional chip selects for simple depth expansion. This permits easy secondary cache upgrades from 256K depth to 512K depth without extra logic. Data Address A [0:18] CLK Microprocessor CLK ...

Page 16

... K7A803601M K7A801801M APPLICATION INFORMATION DEPTH EXPANSION The Samsung 512Kx18 Synchronous Pipelined Burst SRAM has two additional chip selects for simple depth expansion. This permits easy secondary cache upgrades from 512K depth to 1M depth without extra logic. Data Address A [0:19] CLK Microprocessor CLK ...

Page 17

... K7A803601M K7A801801M PACKAGE DIMENSIONS 100-TQFP-1420A 22.00 20.00 #1 0.65 256Kx36 & 512Kx18 Synchronous SRAM 0.30 0.20 16.00 0.30 14.00 0.20 (0.83) (0.58) 0.30 0.10 0.10 MAX 1.40 1.60 MAX 0.10 0.05 MIN 0.50 0. Units ; millimeters/Inches 0~8 + 0.10 0.127 - 0.05 0.10 MAX 0.50 0.10 May 1999 Rev 3.0 ...

Related keywords