EVAL-ADMP441Z AD [Analog Devices], EVAL-ADMP441Z Datasheet - Page 11

• Manufacturer Part Number: EVAL-ADMP441Z
• Description: Omnidirectional Microphone
• Manufacturer: AD [Analog Devices]

Data Sheet
APPLICATIONS INFORMATION
POWER SUPPLY DECOUPLING
For best performance and to avoid potential parasitic artifacts,
placing a 0.1 μF ceramic type X7R or better capacitor between
Pin 7 (V
capacitor should be placed as close to Pin 7 as possible.
The connections to each side of the capacitor should be as short
as possible, and the trace should stay on a single layer with no
vias. For maximum effectiveness, locate the capacitor equidistant
from the power and ground pins or, when equidistant placement
is not possible, slightly closer to the power pin. Thermal connec-
tions to the ground planes should be made on the far side of the
capacitor, as shown in Figure 14.
HANDLING INSTRUCTIONS
Pick-and-Place Equipment
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
•
•
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
Use care during pick-and-place to ensure that no high
shock events above 10,000 g are experienced because such
events may cause damage to the microphone.
Figure 14. Recommended Power Supply Bypass Capacitor Layout
DD
) and ground is strongly recommended. The
CAPACITOR
TO V
DD
V
DD
TO GND
GND
Rev. A | Page 11 of 16
•
•
Reflow Solder
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile does not exceed the
limit conditions specified in Figure 4 and Table 5.
Board Wash
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
SUPPORTING DOCUMENTATION
Evaluation Board User Guide
UG-303, EVAL-ADMP441Z-FLEX: Bottom-Port I
MEMS Microphone Evaluation Board
Circuit Note
CN-0208, High Performance Digital MEMS Microphone's Simple
Interface to SigmaDSP Audio Processor with I
Application Notes
AN-1112 Application
Terms Explained
AN-1003 Application
Connecting Analog Devices, Inc., Bottom-Ported MEMS
Microphones
AN-1068 Application
Microphone
AN-1124 Application
Analog Devices, Inc., Bottom-Port MEMS Microphones from
Dust and Liquid Ingress
For additional information, visit www.analog.com/mic.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
Note, Microphone Specifications and
Note, Recommendations for Mounting and
Note, Reflow Soldering of the MEMS
Note, Recommendations for Sealing
2
S Output
ADMP441
2
S Output