EVAL-ADMP504Z-FLEX AD [Analog Devices], EVAL-ADMP504Z-FLEX Datasheet - Page 9

• Manufacturer Part Number: EVAL-ADMP504Z-FLEX
• Description: Ultralow Noise Microphone
• Manufacturer: AD [Analog Devices]

Data Sheet
PCB LAND PATTERN LAYOUT
The recommended PCB land pattern for the
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 10. Take care to avoid applying
solder paste to the sound hole in the PCB. A suggested solder
1.90
1.22
0.2 × 45°
1.22
0.8 × 0.6
TYP
0.68
ADMP504
Figure 11. Suggested Solder Paste Stencil Pattern Layout
2×
Figure 10. PCB Land Pattern Layout
0.90
should
Rev. 0 | Page 9 of 12
1.52mm
1.52
0.225 CUT WIDTH (2×)
paste stencil pattern layout is shown in Figure 11. The diameter
of the sound hole in the PCB should be larger than the diameter
of the sound port of the microphone. A minimum diameter of
0.5 mm is recommended.
Ø1.55
Ø0.95
1.55/1.05 DIA.
0.61
0.61
ADMP504