MC10H101PG ON Semiconductor, MC10H101PG Datasheet - Page 4

IC GATE OR/NOR QUAD ECL 16-DIP

MC10H101PG

Manufacturer Part Number
MC10H101PG
Description
IC GATE OR/NOR QUAD ECL 16-DIP
Manufacturer
ON Semiconductor
Series
10Hr
Datasheet

Specifications of MC10H101PG

Logic Type
NOR/OR Gate
Number Of Circuits
4
Number Of Inputs
8 Input (2, 2, 2, 2)
Schmitt Trigger Input
No
Output Type
Differential
Operating Temperature
0°C ~ 75°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Product
MUX Gates
Logic Family
ECL
High Level Output Current
- 50 mA
Low Level Output Current
50 mA
Propagation Delay Time
1.6 ns
Supply Voltage (max)
- 5.46 V
Supply Voltage (min)
- 4.94 V
Maximum Operating Temperature
+ 75 C
Mounting Style
Through Hole
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Current - Output High, Low
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC10H101PG
Manufacturer:
ON/安森美
Quantity:
20 000
C
−L−
0.010 (0.250)
20
Z
G1
S
G
T
1
−N−
L−M
S
A
R
V
N
VIEW S
S
−M−
E
Y BRK
J
0.007 (0.180)
0.007 (0.180)
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
7. DIMENSION H DOES NOT INCLUDE DAMBAR
−T−
W
1982.
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
DATUM −T−, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.004 (0.100)
SEATING
PLANE
M
M
PACKAGE DIMENSIONS
D
D
T
T
L−M
L−M
http://onsemi.com
20 LEAD PLLC
CASE 775−02
S
S
ISSUE E
N
N
B
Z
S
S
4
VIEW D−D
U
0.007 (0.180)
K1
X
0.007 (0.180)
K
M
T
VIEW S
L−M
M
G1
T
S
L−M
DIM
F
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
H
N
S
0.010 (0.250)
S
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
MIN
−−−
0.050 BSC
0.007 (0.180)
2
N
INCHES
0.007 (0.180)
_
S
0.395
0.395
0.180
0.110
0.019
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
MAX
−−−
−−−
10
−−−
_
S
M
MILLIMETERS
T
MIN
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
M
−−−
1.27 BSC
2
L−M
T
_
T
L−M
10.03
10.03
L−M
MAX
4.57
2.79
0.48
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
S
−−−
−−−
10
−−−
_
S
N
S
S
N
N
S
S

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