A1010B ACTEL [Actel Corporation], A1010B Datasheet - Page 3

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A1010B

Manufacturer Part Number
A1010B
Description
ACT 1 Series FPGAs
Manufacturer
ACTEL [Actel Corporation]
Datasheet

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source 10 mA at TTL levels. See Electrical Specifications for
additional I/O buffer specifications.
D evice O rgani zat i o n
ACT 1 devices consist of a matrix of logic modules arranged in
rows separated by wiring channels. This array is surrounded
by a ring of peripheral circuits including I/O buffers,
testability circuits, and diagnostic probe circuits providing
real-time diagnostic capability. Between rows of logic
modules are routing channels containing sets of segmented
metal tracks with PLICE antifuses. Each channel has 22
signal tracks. Vertical routing is permitted via 13 vertical
tracks per logic module column. The resulting network allows
arbitrary and flexible interconnections between logic
modules and I/O modules.
Pro be Pin
ACT 1 devices have two independent diagnostic probe pins.
These pins allow the user to observe any two internal signals
by entering the appropriate net name in the diagnostic
software. Signals may be viewed on a logic analyzer using
Actel’s Actionprobe
also be used as user-defined I/Os when debugging is finished.
Orderin g Infor m at i on
A1010
®
diagnostic tools. The probe pins can
Part Number
B
A1010
A1020
A10V10 = 1200 Gates (3.3 V)
A10V20 = 2000 Gates (3.3 V)
Die Revision
2
B = 1.0 micron CMOS Process
= 1200 Gates (5 V)
= 2000 Gates (5 V)
Speed Grade
PL
Blank = Standard Speed
–1
–2
–3
Package Type
84
= Approximately 15% faster than Standard
= Approximately 25% faster than Standard
= Approximately 35% faster than Standard
PL
PQ = Plastic Quad Flatpacks
CQ = Ceramic Quad Flatpack
PG = Ceramic Pin Grid Array
VQ = Very Thin Quad Flatpack
Package Lead Count
= Plastic J-Leaded Chip Carriers
C
ACT 1 Ar ray P erfo rmance
Temperature and Voltage Effects
Worst-case delays for ACT 1 arrays are calculated in the same
manner as for masked array products. A typical delay
parameter is multiplied by a derating factor to account for
temperature, voltage, and processing effects. However, in an
ACT 1 array, temperature and voltage effects are less
dramatic than with masked devices. The electrical
characteristics of module interconnections on ACT 1 devices
remain constant over voltage and temperature fluctuations.
As a result, the total derating factor from typical to
worst-case for a standard speed ACT 1 array is only 1.19 to 1,
compared to 2 to 1 for a masked gate array.
Logic Module Size
Logic module size also affects performance. A mask
programmed gate array cell with four transistors usually
implements only one logic level. In the more complex logic
module (similar to the complexity of a gate array macro) of
an ACT 1 array, implementation of multiple logic levels
within a single module is possible. This eliminates interlevel
wiring and associated RC delays. The effect is termed “net
compression.”
Application (Temperature Range)
C = Commercial (0 to +70 C)
I
M = Military (–55 to +125 C)
B = MIL-STD-883
= Industrial (–40 to +85 C)
A C T
1 S eri es FPG A s
1-285

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