NSE-5310 AMSCO [austriamicrosystems AG], NSE-5310 Datasheet - Page 19

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NSE-5310

Manufacturer Part Number
NSE-5310
Description
Manufacturer
AMSCO [austriamicrosystems AG]
Datasheet
NSE-5310
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Custom chip-on-board packaging can be provided for qualified OEMs. Minimum order quantities apply. Inquire for more detail.
Figure 16. Custom Chip-On-Board Packaging (5.4 x 4.2 x 0.6 mm)
0.62 mm
Centerline of
Centerline
sensor Array
of IC
2 mm
0.5 mm
Magnet centered
on hall elements
4.2 mm
Custom wafer-level chip scale packaging can be provided for qualified OEMs. Minimum order quantities apply. Inquire for more detail.
Figure 17. Custom Wafer-Level Chip Scale Packaging (as small as 3.9 x 2.5 x 0.6 mm)
0.62 mm
Centerline of
Centerline
sensors
of IC
Magnet centered
2 mm
on hall elements
0.5 mm
1.13 mm
Gap .26 +/-.2 mm
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Revision 1.0
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