74AHC138D,112 NXP Semiconductors, 74AHC138D,112 Datasheet

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Rev. 03 — 28 November 2007 1. General description The 74AHC138; 74AHCT138 are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC ...

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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74AHC138D +125 C 74AHCT138D 74AHC138PW +125 C 74AHCT138PW 74AHC138BQ +125 C 74AHCT138BQ 4. Functional diagram Fig 1. Logic symbol Fig 3. Functional diagram 74AHC_AHCT138_3 Product data sheet 74AHC138; 74AHCT138 Description SO16 plastic small outline package; 16 leads; ...

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... NXP Semiconductors 5. Pinning information 5.1 Pinning 138 GND 001aad033 Fig 4. Pin configuration for SO16 and TSSOP16 5.2 Pin description Table 2. Pin description Symbol Pin GND 15, 14, 13, 12, 11, 10 74AHC_AHCT138_3 Product data sheet 74AHC138; 74AHCT138 3-to-8 line decoder/demultiplexer; inverting (1) The die substrate is attached to this pad using conductive die attach material ...

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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level don’t care 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage ...

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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V) ...

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... NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions For type 74AHCT138 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 8 LOW-level output voltage 8 input leakage GND current 5 supply current 5 additional per input pin; ...

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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions For type 74AHC138 t propagation An to Yn; see pd delay Yn; see Yn; see power pF dissipation V = GND capacitance 74AHC_AHCT138_3 Product data sheet 74AHC138 ...

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... NXP Semiconductors Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions For type 74AHCT138 t propagation An to Yn; see pd delay Yn; see Yn; see power pF dissipation V = GND capacitance [1] Typical values are measured at nominal supply voltage (V [2] ...

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... NXP Semiconductors Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. The inputs En to outputs Yn propagation delays Table 8. Measurement points Type 74AHC138 74AHCT138 74AHC_AHCT138_3 Product data sheet 74AHC138; 74AHCT138 V CC E1, E2 input ...

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... NXP Semiconductors PULSE GENERATOR Test data is given in Table 9. Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 8. Load circuit for switching times Table 9. Test data Type Input ...

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... NXP Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

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... NXP Semiconductors DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

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... Document ID Release date 74AHC_AHCT138_3 20071128 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...

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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Revision history ...