E4717DBG SEMTECH [Semtech Corporation], E4717DBG Datasheet - Page 14

• Manufacturer Part Number: E4717DBG
• Description: Quad Channel, Per Pin Precision Measurement Unit
• Manufacturer: SEMTECH [Semtech Corporation]

TEST AND MEASUREMENT PRODUCTS
Package Information (continued)
P
2005 Semtech Corp. / Rev. 5, 10/14/05
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
All dimensions are in millimeters.
“e” represents the basic solder ball grid pitch.
“M” represents the basic solder ball matrix size, and
symbol “N” is the maximum allowable number of
balls after depopulating.
“b” is measured at the maximum solder ball diameter
(after reflow) parallel to primary datum –C– .
Dimension “aaa” is measured parallel to primary datum –C– .
Primary datum –C– and seating plane are defined by the
spherical crowns of the solder balls.
Package surface shall be black oxide.
Cavity depth varies with die thickness.
Substrate material base is copper.
Bilateral tolerance zone is applied to each side of package body.
45 degree 0.5 mm Chamfer corner and white dot for Pin 1
identification.
Detail A
5
c
aaa C
A1
Side View
A
14
–C–
/ / ccc C
6
Detail A
b
R
A
A
D
D
E
E
b
c
M
N
a
c
e
g
P
Detail B
c
1
1
a
E
1
c
a
. F
D
i
m
e
2
2
0
M
1
0
0
0
0
2
2
5 .
n
2 .
4 .
8 .
3 .
1 .
g
I
8 .
8 .
s
N
2
5
0
5
5
5
o i
.
0
0
5
n
l a
2
2
1
Edge4717D
1
1
R
2
2
0 .
N
0 .
0 .
0
0
0
e
2
1
3
3
2
O
5 .
6 .
9 .
0
0
0
2
f
4 .
0 .
0 .
2
M
e
8
0
5
0
T
B
B
0
0
r
.
Y
S
S
e
P
g
C
C
n
www.semtech.com
c
4
e
0.30 S C A S B S
0.10 S C
2
2
0
s
M
1
0
0
0
0
3
3
7 .
5 .
6 .
9 .
1 .
2 .
A
2 .
2 .
7
. X
5
0
5
5
5
0
0
5