M393B1G70EM1 SAMSUNG [Samsung semiconductor], M393B1G70EM1 Datasheet - Page 13

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M393B1G70EM1

Manufacturer Part Number
M393B1G70EM1
Description
DDR3 SDRAM Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
Product Guide
(Datum B)
96Ball FBGA for 2Gb B-die (x16)
(Post Reflow ∅0.50 ± 0.05)
78Ball FBGA for 2Gb B-die (x4/x8)
(Post Reflow ∅0.50 ± 0.05)
(Datum A)
(Datum B)
(Datum A)
96 - ∅0.45 Solder ball
78 - ∅0.45 Solder ball
0.2
0.2
G
M
A
B
C
D
E
F
H
K
N
P
R
T
J
L
M
A
B
C
D
E
G
H
K
N
F
J
L
M
M
A B
A B
9
9
0.80
0.80
8 7 6 5 4 3 2 1
8 7 6 5 4 3 2 1
9.00 ± 0.10
1.60
9.00 ± 0.10
Bottom
1.60
Bottom
(1.90)
(1.90)
(0.95)
3.20
(0.95)
3.20
MOLDING AREA
MOLDING AREA
A
A
#A1 INDEX MARK
#A1 INDEX MARK
B
B
- 13 -
#A1
#A1
9.00 ± 0.10
Top
9.00 ± 0.10
Top
DDR3 SDRAM Memory
1.10 ± 0.10
1.10 ± 0.10
May. 2010
0.35 ± 0.05
0.35 ± 0.05

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