M393B1G70EM1 SAMSUNG [Samsung semiconductor], M393B1G70EM1 Datasheet - Page 4

• Manufacturer Part Number: M393B1G70EM1
• Description: DDR3 SDRAM Memory
• Manufacturer: SAMSUNG [Samsung semiconductor]

Product Guide
3. DDR3 SDRAM Module Ordering Information
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
7. Bit Organization
1. Memory Module : M
2. DIMM Type
3. Data Bits
4. DRAM Component Type
5. Depth
6. # of Banks in comp. & Interface
71 : x64 204pin Unbuffered SODIMM
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
B : DDR3 SDRAM (1.5V VDD)
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G :
2G :
7 :
0 : x 4
3 : x 8
4 : x16
3 : DIMM
4 : SODIMM
8Banks & SSTL-1.5V
1G
2G
M X X X B X X X X X X X - X X X
1
2
57 : 256M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
2K : 2G (for 2Gb)
33 : 32M (for 128Mb/512Mb)
65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
52 : 512M (for 512Mb/2Gb)
3
4
5
6
7
- 4 -
8
9. Package
10. PCB Revision
11. Temp & Power
12. Speed
8. Component Revision
NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
9
C
Y
F7
F8
H9
K0
M
B
D
F : 7th Gen.
Z
H
J
M
0 : None
2 : 2nd Rev.
4 : 4th Rev.
: DDR3-800
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
:
:
:
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
10
:
:
:
:
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
3rd Gen.
5th Gen.
1st Gen.
FBGA(Lead-free)
FBGA(Lead-free & Halogen-free)
FBGA(Lead-free, DDP)
FBGA(Lead-free & Halogen-free, DDP)
11
DDR3 SDRAM Memory
(400MHz @ CL=6, tRCD=6, tRP=6)
12
G
C
E
A
1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer
:
:
:
:
6th Gen.
2nd Gen.
4th Gen.
8th Gen.
Component Revision
Temp & Power
PCB Revision
May. 2010
Package
Speed