KMM5364003BSW SAMSUNG [Samsung semiconductor], KMM5364003BSW Datasheet - Page 18
![no-image](/images/no-image-200.jpg)
KMM5364003BSW
Manufacturer Part Number
KMM5364003BSW
Description
4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.KMM5364003BSW.pdf
(18 pages)
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DRAM MODULE
PACKAGE DIMENSIONS
1.000(31.75)
.250(6.35)
.133(3.38)
.080(2.03)
.250(6.35)
.010(.25)MAX
Gold/Solder Plating Lead
.050(1.27)
Tolerances : .005(.13) unless otherwise specified
NOTE : The used device is 4Mx16 & Quad CAS 4Mx4 DRAM, TSOPII
DRAM Part No. : KMM5364003BSW/BSWG -- KM416C4100BS & KM44C4003CS(300 mil)
R.062(1.57)
.250(6.35)
.041 .004(1.04 .10)
( Front view )
4.250(107.95)
3.984(101.19)
( Back view )
3.750(95.25)
.125 DIA .002(3.18 .051)
R.062 .004(R1.57 .10)
.054(1.37)
.047(1.19)
KMM5364003BSW/BSWG
.100(2.54)
(3.20MIN)
0.125 MIN
MAX
Units : Inches (millimeters)
.400(10.16)
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