HCTS30HMSR INTERSIL [Intersil Corporation], HCTS30HMSR Datasheet - Page 9

• Manufacturer Part Number: HCTS30HMSR
• Description: Radiation Hardened 8-Input NAND Gate
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
87 x 88 mils
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS30 is TA14428A.
B (2)
C (3)
D (4)
E (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
(1)
(6)
A
F
HCTS30MS
HCTS30MS
GND
VCC
(14)
(7)
448
(13)
(8)
NC
Y
Spec Number
(12) H
(11) G
(10) NC
(9) NC
518639