HCTS390DMSR INTERSIL [Intersil Corporation], HCTS390DMSR Datasheet
![no-image](/images/no-image-200.jpg)
HCTS390DMSR
Related parts for HCTS390DMSR
HCTS390DMSR Summary of contents
Page 1
... CMOS/SOS Logic Family . The HCTS390MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS390DMSR HCTS390KMSR HCTS390D/Sample HCTS390K/Sample HCTS390HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
Page 2
Functional Diagram 4(12) nCP1 1(15) nCP0 2(14) nMR H = High Level L = Low Logic Level X = Immaterial HCTS390MS 3(13) 5(11) 6(10) nQ0 nQ1 nQ2 TRUTH TABLE INPUTS CP MR ACTION L ...
Page 3
Absolute Maximum Ratings Supply Voltage (VCC -0.5 to +7.0V Input Voltage Range, All Inputs . ...
Page 4
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL CP0N to Q0n TPHL VCC = 4.5V TPLH CP1Nn to Q1n TPHL VCC = 4.5V TPLH CP1Nn to Q2n TPHL VCC = 4.5V TPLH CP1Nn to Q3n TPHL VCC = 4.5V TPLH ...
Page 5
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...
Page 6
CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate Group A in accordance ...
Page 7
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 8
AC Timing Diagrams TR TF INPUT LEVEL TPLH Q0 VS FIGURE 1. INPUT PULSE PRE-REQUISITE, PROPAGATION- DELAY, AND OUTPUT-TRANSITION TIMES TTLH VOH 80% 20% OUTPUT VOL FIGURE 3. OUTPUT TRANSITION TIME AC Load Circuit HCTS390MS INPUT ...
Page 9
Die Characteristics DIE DIMENSIONS mils 2190 m x 2190 m METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 ...