TGA8014 TRIQUINT [TriQuint Semiconductor], TGA8014 Datasheet
TGA8014
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TGA8014 Summary of contents
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... TWT replacement amplifiers. Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermcompression and thermosonic wire- bonding processes. The TGA8014-SCC is supplied in chip form and is readily assembled using automated equipment. TriQuint Semiconductor Texas Phone: (972)994 8465 ...
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... TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8014-SCC Fax: (972)994 8504 Web: www.triquint.com 2 ...
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... TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8014-SCC Fax: (972)994 8504 Web: www.triquint.com 3 ...
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... Diagram.” The S-parameters are also available on floppy disk and the world wide web. RF CHARACTERISTICS G p SWR (in) SWR (out) P 1dB The TGA8014-SCC is intended strictly for use in a balanced configuration. TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet ...
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... RF connections: Bond two 1-mil diameter, 25-mil-length gold bond wires at both RF Input and RF Output for optimum RF performance. Close placement of external components is essential to stability. Refer to TriQuint’s Recommended Assembly Instructions for GaAs Products. TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8014-SCC 50% I Fax: (972)994 8504 Web: www ...
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... MECHANICAL DRAWING GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8014-SCC Fax: (972)994 8504 Web: www.triquint.com 6 ...