TSM931 TOUCHSTONE [Touchstone Semiconductor Inc], TSM931 Datasheet - Page 18

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TSM931

Manufacturer Part Number
TSM931
Description
Ultra Low-Power Single/Dual-Supply Comparators with Reference
Manufacturer
TOUCHSTONE [Touchstone Semiconductor Inc]
Datasheet
TSM931-TSM934
PACKAGE OUTLINE DRAWING
Page 18
1.75 Max
0.33 - 0.51
Notes:
4.
5.
6.
3.
2
1
7' REF ALL SIDE
Does not include mold flash, protrusions or gate burns.
Mold flash, protrusions or gate burrs shall not exceed
0.15 mm per side.
Does not include inter-lead flash or protrusions. Inter-lead
flash or protrusions shall not exceed 0.25 mm per side.
Lead span/stand off height/coplanarity are considered as
special characteristic (s).
Controlling dimensions are in mm.
This part is compliant with JEDEC specification MS-012
Lead span/stand off height/coplanarity are considered as
Special characteristic.
1.27 TYP
4.80 - 5.00
8-Pin SOIC Package Outline Drawing
0.546 REF
1
0.10 – 0.25
(N.B., Drawings are not to scale)
1.32 – 1.52
5.80 – 6.20
0.10 Max
GAUGE PLANE
0.25
LEADFARME
THICKNESS
0.19 – 0.25
0.406 – 0.863
ALL SIDE
7' REF
3.81 – 3.99
3.73 - 3.89
0.48 Max
45' Angle
0.28 Min
2
2
TSM931_34DS r1p0
0.76 Max
0.66 Min
0 - 8°
RTFDS

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