K7I163682B_06 SAMSUNG [Samsung semiconductor], K7I163682B_06 Datasheet - Page 18

• Manufacturer Part Number: K7I163682B_06
• Description: 512Kx36 & 1Mx18 DDRII CIO b2 SRAM
• Manufacturer: SAMSUNG [Samsung semiconductor]

K7I163682B
K7I161882B
165 FBGA PACKAGE DIMENSIONS
13mm x 15mm Body, 1.0mm Bump Pitch, 11x15 Ball Array
Symbol
A
B
C
D
0.35 ± 0.05
1.3 ± 0.1
13 ± 0.1
15 ± 0.1
Value
B
C
F
Units
mm
mm
mm
mm
E
Note
512Kx36 & 1Mx18 DDRII CIO b2 SRAM
A
A
G
- 18 -
Symbol
G
H
E
F
0.5 ± 0.05
H
Value
14.0
10.0
1.0
B
D
E
∅
Rev. 5.0 July 2006
Top View
Side View
Bottom View
Units
mm
mm
mm
mm
Note