MX25L3225DM2I-10G MCNIX [Macronix International], MX25L3225DM2I-10G Datasheet - Page 3

• Manufacturer Part Number: MX25L3225DM2I-10G
• Description: 32M-BIT [x 1/x 2/x 4] CMOS SERIAL FLASH
• Manufacturer: MCNIX [Macronix International]

P/N: PM1432
POWER-ON STATE ................................................................................................................................................... 26
ELECTRICAL SPECIFICATIONS .............................................................................................................................. 27
Timing Analysis ....................................................................................................................................................... 31
(18) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) ............................................. 23
Table 7. ID Definitions ....................................................................................................................................... 24
(19) Enter Secured OTP (ENSO) ...................................................................................................................... 24
(20) Exit Secured OTP (EXSO) ........................................................................................................................ 24
(21) Read Security Register (RDSCUR) ........................................................................................................... 24
Table 8. Security Register Definition ................................................................................................................. 25
(22) Write Security Register (WRSCUR) ........................................................................................................... 25
ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 27
CAPACITANCE TA = 25° C, f = 1.0 MHz ........................................................................................................... 27
Figure 2.Maximum Negative Overshoot Waveform ............................................................................................ 27
Figure 3. Maximum Positive Overshoot Waveform ............................................................................................ 27
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL ............................................................. 28
Figure 5. OUTPUT LOADING .......................................................................................................................... 28
Table 9. DC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) ....... 29
Table 10. AC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) .... 30
Figure 6. Serial Input Timing ............................................................................................................................. 31
Figure 7. Output Timing .................................................................................................................................... 31
Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ..................................................... 32
Figure 9. Write Enable (WREN) Sequence (Command 06) ................................................................................ 32
Figure 10. Write Disable (WRDI) Sequence (Command 04) ............................................................................... 32
Figure 11. Read Identification (RDID) Sequence (Command 9F) ....................................................................... 33
Figure 12. Read Status Register (RDSR) Sequence (Command 05) ................................................................. 33
Figure 13. Write Status Register (WRSR) Sequence (Command 01) ................................................................ 33
Figure 14. Read Data Bytes (READ) Sequence (Command 03) ....................................................................... 34
Figure 15. Read at Higher Speed (FAST_READ) Sequence (Command 0B) .................................................... 34
Figure 16. 2 x I/O Read Mode Sequence (Command BB) ................................................................................. 35
Figure 17. 4 x I/O Read Mode Sequence (Command EB) ................................................................................. 35
Figure 18. 4 x I/O Read enhance performance Mode Sequence (Command EB) ............................................... 36
Figure 19. Page Program (PP) Sequence (Command 02) ................................................................................. 37
Figure 20. 4 x I/O Page Program (4PP) Sequence (Command 38) ................................................................... 37
Figure 21. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 38
Figure 22. Sector Erase (SE) Sequence (Command 20) .................................................................................. 38
Figure 23. Block Erase (BE) Sequence (Command D8) ................................................................................... 38
Figure 24. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................ 39
Figure 25. Deep Power-down (DP) Sequence (Command B9) .......................................................................... 39
Figure 26. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB) .. 39
Figure 27. Release from Deep Power-down (RDP) Sequence (Command AB) .................................................. 40
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MX25L3225D
REV. 0.00, SEP. 19, 2008