EMIF02-SPK01F2_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-SPK01F2_11 Datasheet
EMIF02-SPK01F2_11
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EMIF02-SPK01F2_11 Summary of contents
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... Mobile phones and communication systems ■ Computers, printers and MCU Boards Description The EMIF02-SPK01 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...
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Electrical characteristics Table 1. Absolute maximum ratings (T Symbol T Maximum junction temperature j T Operating temperature range op T Storage temperature range stg Figure 3. Electrical characteristics (definitions) Symbol ...
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Figure 4. S21 (dB) attenuation measurements and Aplac simulation 0. -5.00 - -10.00 -15. -20.00 -25.00 - -30.00 - -35.00 -40.00 100.0k 1.0M 1.0M 10.0M 100.0M f/Hz Figure 6. ESD response to IEC 61000-4-2 (+15kV air ...
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... M=0.3333 RS=0.7 VJ=0.6 TT=50n 4/7 Rspk Lspk Lbump Rbump OUT1 model = D2 GND model = D3 model = D2 OUT2 Rspk Lspk Lbump Rbump EMIF02-SPK01F1 model aplacvar Ls 1nH Model D3 Model D2 aplacvar Rs 150m CJO=Cdiode3 CJO=Cdiode2 aplacvar Rspk 10 BV=7 BV=7 aplacvar Lspk 10p IBV=1u IBV=1u aplacvar Cdiode1 234pF IKF=1000 IKF=1000 aplacvar Cdiode2 3.5ppF ...
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Ordering information Figure 11. Ordering information scheme 3 Packaging information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and ...
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... Figure 15. Packing 4 Ordering information Table 3. Ordering information Order code EMIF02-SPK01F2 Note: More packing information is available in the applications note: AN1235: “Flip-Chip: package description and recommendations for use” AN 1751: “EMI filters: Recomendations and measurements” 5 Revision history Table 4. Document revision history Date ...
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any ...