EMIF02-SPK01F2_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-SPK01F2_11 Datasheet - Page 5

• Manufacturer Part Number: EMIF02-SPK01F2_11
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

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Ordering information
Figure 11. Ordering information scheme
Packaging information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 12. Flip-Chip dimensions
Figure 13. Footprint
340 µm min for 315 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330µm
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Copper pad Diameter :
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
500 µm ± 10
250 µm ± 10
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Doc ID 11740 Rev 2
1.07 mm ± 50µm
315 µm ± 50
Figure 14. Marking
EMIF yy - xxx zz Fx
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
650 µm ± 50
x
y
w
x
w
E
z
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