EMIF10-1K010F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF10-1K010F2_08 Datasheet - Page 6
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EMIF10-1K010F2_08
Manufacturer Part Number
EMIF10-1K010F2_08
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.EMIF10-1K010F2_08.pdf
(8 pages)
Ordering information
5
Note:
6/8
Figure 14. Flip Chip tape and reel specification
Ordering information
Table 3.
More information is available in the application notes:
AN1235: “Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements
Figure 12. Footprint recommendations
340 µm min for 310 µm copper pad diameter
EMIF10-1K010F2
Solder mask opening recommendation:
Order code
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
Ordering information
All dimensions in mm
Marking
FD
0.73 ± 0.05
Dot identifying Pin A1 location
Package
Flip Chip
User direction of unreeling
Figure 13. Marking
Dot, ST logo
xx = marking
z = manufacturing
location
yww = datecode
4 ± 0.1
Weight
7.9 mg
2.60
(y = year
4 ± 0.1
ww = week)
Ø 1.5 ± 0.1
Base qty
5000
x
y
EMIF10-1K010F2
Delivery mode
w
Tape and reel
x
E
w
z