MASW-001150-13160 MA-COM [M/A-COM Technology Solutions, Inc.], MASW-001150-13160 Datasheet

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MASW-001150-13160

Manufacturer Part Number
MASW-001150-13160
Description
SURMOUNT PIN Diode Switch Element
Manufacturer
MA-COM [M/A-COM Technology Solutions, Inc.]
Datasheet
1
Features
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Description
A PIN diode series-shunt switch element with a unique
integrated thermal terminal for dissipating heat in the
series diode created by the DC and RF input power.
The thermal terminal allows for optimum heat dissipa-
tion by providing a direct thermal connection between
the series diode and the circuit heatsink while also
being electrically isolated. The chip is designed to pro-
vide a heat transfer conduit that does not interfere with
the PIN diode anode (input) and cathode (output) elec-
trical terminals, especially with respect to RF
formance. The chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process and
features silicon
low dispersion glass for low leakage current. The top-
side is fully
an additional polymer layer to protect against damage
during handling and assembly
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
Applications
This PIN diode series-shunt switch element is
particularly advantageous in high average power,
50W, switch applications from 30MHZ – 3GHz. The
backside RF, D.C., and thermal I/O ports allow for
direct solder re-flow, surface mount, attachment to a
micro-strip circuit assembly. The thermal terminal
design provides the, power dissipating, series diode a
direct connection to the circuit thermal ground for
unprecedented heat transfer. The thermal terminal
port is electrically isolated from the I/O ports and can
be configured as either a reflective or an absorptive
switch.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MASW-001150-1316
Specified Bandwidth: 45MHz—2.5GHz
Useable 30MHz to 3.0GHz
Low Loss <0.5dB
High isolation >40dB
High C.W. Incident Power, 50W at 500MHz
High Input IP3, +66dBm @ 500MHz
Unique Thermal Terminal for Series Diode
Surface Mount Device (No Wire Bonds)
Rugged Silicon-Glass Construction
Silicon Nitride Passivation Protective Polymer
Protective Polymer Scratch Protection
RoHS Compliant
encapsulated with silicon nitride and has
pedestals embedded in a low loss,
.
per-
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
2. Reference
Ordering Information
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
Mounting Temperature
MASW-001150-13160W
MASW-001150-13160P
Visit www.macomtech.com for additional data sheets and product information.
Part Number
Parameter
Application Note M513
Absolute Maximum Ratings
ESD
ESD
ESD
• China Tel: +86.21.2407.1588
2
+260°C for 30 seconds
for reel size information.
Absolute Maximum
Class 1A — HBM
WAFFLE PACK
POCKET TAPE
-55°C to +125°C
-55°C to +150°C
Class M3 — MM
Class C3 — CDM
500MHz, 4W
500MHz, 50W
Package
+175°C
100mA
- 180V
V5

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MASW-001150-13160 Summary of contents

Page 1

... Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Ordering Information per- Part Number MASW-001150-13160W MASW-001150-13160P 2. Reference Application Note M513 Absolute Maximum Ratings Parameter Forward Current Reverse Voltage ...

Page 2

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Electrical Specifications @ T Symbol Parameter C Total Capacitance T Series C Total Capacitance T Series C Total Capacitance T Shunt C Total Capacitance T Shunt R Series Resistance S Series R Series Resistance S Series R Series Resistance S Series R Series Resistance S Series R Series Resistance S Shunt R Series Resistance ...

Page 3

... PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MASW-001150-13160 Isolation_+5mA Return loss_-50 mA Insertion Loss_-50mA 1 ...

Page 4

... Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MASW-001150-13160W • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 Visit www ...

Page 5

... Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MASW-001150-13160W • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 Visit www ...

Page 6

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal RF , DC, and Thermal Circuit Footprint ( Topview ) RF Output Trace Direction 20 ±1 mil (4) PL D.C Ground or RF Trace Direction 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...

Page 7

... Hatched yellow areas are I/O ports (die solder pads) Ordering Information Part Number Packaging MASW-001150-13160W MASW-001150-13160P Pocket Tape • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice ...

Page 8

... Ordering Information for Test Board Part Number MASW-001150-001SMB • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice ...

Page 9

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Assembly Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. ...

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