MASW-004240-13170W_2 MA-COM [M/A-COM Technology Solutions, Inc.], MASW-004240-13170W_2 Datasheet
MASW-004240-13170W_2
Related parts for MASW-004240-13170W_2
MASW-004240-13170W_2 Summary of contents
Page 1
... The DC bias bond pads are labeled B2-B5 and are also 375x375µM (15x15mils) square. Applications The MASW-004240-13170W has been designed for 24GHz automotive radar sensor applications and is also ideally suited for use at 10GHz. The switch is turned on by applying a forward current of +12mA the appropriate bias port and is turned off at 0V ...
Page 2
... PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MASW-004240-13170W (SP4T) AMB Port 1 Port 2 ...
Page 3
... MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch with Integrated Bias Network TYPICAL INSERTION LOSS 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5 Frequency (GHz) TYPICAL INPUT RETURN LOSS -10 -12 -14 -16 -18 - Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development ...
Page 4
... HMIC™ SP4T Surface Mount Silicon PIN Diode Switch with Integrated Bias Network Operation of the MASW-004240-13170W Operation of the MASW-00420-13170W PIN diode switch is achieved by simultaneously applying a current of +12mA DC to the bias port of the on arm and 0V to the remaining isolated off arms. Control Level ( DC Current ) at Port ...
Page 5
... MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch with Integrated Bias Network Chip Dimensions and Pad Locations R.F. & DC ground 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...
Page 6
... Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per manufacturer’s recommended schedule. Typically 150°C for 1 hour. MASW-004240-13170W 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development ...