HMC475ST89_10 HITTITE [Hittite Microwave Corporation], HMC475ST89_10 Datasheet - Page 4

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HMC475ST89_10

Manufacturer Part Number
HMC475ST89_10
Description
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4.5 GHz
Manufacturer
HITTITE [Hittite Microwave Corporation]
Datasheet
Absolute Maximum Ratings
Outline Drawing
Package Information
Collector Bias Voltage (Vcc)
RF Input Power (RFIN)(Vcc = +7.2 Vdc)
Junction Temperature
Continuous Pdiss (T = 85 °C)
(derate 16.86 mW/°C above 85 °C)
Thermal Resistance
(junction to lead)
Storage Temperature
Operating Temperature
[1] Max peak refl ow temperature of 235 °C
[2] Max peak refl ow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
HMC475ST89E
HMC475ST89
Part Number
Phone: 978-250-3343
RoHS-compliant Low Stress Injection Molded Plastic
Application Support: Phone: 978-250-3343 or apps@hittite.com
Low Stress Injection Molded Plastic
Package Body Material
+8.0 Vdc
+17 dBm
150 °C
1.09 W
59.3 °C/W
-65 to +150 °C
-40 to +85 °C
v02.0710
Fax: 978-250-3373
NOTES:
1. PACKAGE BODY MATERIAL:
2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.
3. LEAD PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS]
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
MOLDING COMPOUND MP-180S OR EQUIVALENT.
HMC475ST89
100% matte Sn
Sn/Pb Solder
MMIC AMPLIFIER, DC - 4.5 GHz
Order On-line at www.hittite.com
Lead Finish
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
InGaP HBT GAIN BLOCK
MSL Rating
MSL1
MSL1
[1]
[2]
/
475ST89E
Package Marking
XXXX
XXXX
H475
H475
[3]
8 - 77
8

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