BCP55-16 T/R Philips, BCP55-16 T/R Datasheet - Page 6

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BCP55-16 T/R

Manufacturer Part Number
BCP55-16 T/R
Description
npn, transistor, sot, Semiconductors and Actives, Transistors, Discretes (diodes, transistors, thyristors ...)
Manufacturer
Philips
Datasheet
Philips Semiconductors
6. Thermal characteristics
9397 750 14041
Product data sheet
Table 7:
[1]
[2]
[3]
Symbol Parameter
R
R
th(j-a)
th(j-sp)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
thermal resistance from
junction to ambient
thermal resistance from
junction to soldering point
Thermal characteristics
BC637
BCP55
BCP55
BCP55
BCX55
BCX55
BCX55
BC639
BCP55
BCX55
Rev. 06 — 18 February 2005
Conditions
T
T
T
T
T
T
T
T
T
T
amb
amb
amb
amb
amb
amb
amb
amb
amb
amb
BC637; BCP55; BCX55
25 C
25 C
25 C
25 C
25 C
25 C
25 C
25 C
25 C
25 C
60 V, 1 A NPN medium power transistor
[1]
[1]
[2]
[3]
[1]
[2]
[3]
Min
-
-
-
-
-
-
-
-
-
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Typ
-
-
-
-
-
-
-
-
-
-
Max
150
192
125
89
250
147
104
40
17
30
2
2
.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
.
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