S9S12G64F1MLC Freescale Semiconductor, S9S12G64F1MLC Datasheet - Page 1289

• Manufacturer Part Number: S9S12G64F1MLC
• Description: 16-bit Microcontrollers - MCU S12CORE,64K FLASH,AU
• Manufacturer: Freescale Semiconductor

Specifications of S9S12G64F1MLC

• Rohs: yes
• Core: S12
• Processor Series: MC9S12G
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 4 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 3.13 V to 5.5 V
• Operating Temperature Range: - 40 C to + 125 C
• Package / Case: LQFP-32
• Mounting Style: SMD/SMT

Freescale Semiconductor
Die Pad
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
Bond Post
MC9S12G Family Reference Manual, Rev.1.23
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
77
78
79
80
81
82
83
84
85
86
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
1707.5
1598.5
1477.5
1237.5
1117.5
947.5
777.5
652.5
527.5
422.5
327.5
242.5
Y Coordinate
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
Die Pad
1026.5
1133.5
1240.5
1347.5
-467.5
-360.5
-253.5
-148.5
172.5
279.5
386.5
493.5
598.5
705.5
812.5
919.5
-41.5
65.5
Function
PAD[10]
PAD[11]
PAD[12]
PAD[13]
PAD[14]
PAD[15]
PAD[9]
PAD[2]
PAD[3]
PAD[4]
PAD[5]
PAD[6]
PAD[7]
VDDA
VSSA
PC[4]
PC[5]
PC[6]
PC[7]
PD[0]
PD[1]
PD[2]
PD[3]
PS[0]
PS[1]
PS[2]
PS[3]
PS[4]
VRH
VRL
Package and Die Information
1291