ADG3304BRUZ Analog Devices Inc, ADG3304BRUZ Datasheet - Page 20

• Manufacturer Part Number: ADG3304BRUZ
• Description: IC XLATOR 4CH 1.2/5.5V 14-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of ADG3304BRUZ

• Logic Function: Translator, Bidirectional
• Number Of Bits: 4
• Input Type: Logic
• Output Type: Logic
• Data Rate: 50Mbps
• Number Of Channels: 4
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 6ns
• Voltage - Supply: 1.15 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-TSSOP
• Supply Voltage: 1.5 V ~ 5.5 V
• No. Of Inputs: 4
• Propagation Delay: 6ns
• Logic Type: Level Translator
• Supply Voltage Range: 1.15V To 5.5V
• Logic Case Style: TSSOP
• No. Of Pins: 14
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG3304
ORDERING GUIDE
Model
ADG3304BRUZ
ADG3304BRUZ-REEL
ADG3304BRUZ-REEL7
ADG3304BCPZ-REEL
ADG3304BCPZ-REEL7
ADG3304BCBZ-REEL
ADG3304BCBZ-REEL7
1
2
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Branding on these packages is limited to three characters due to space constraints.
Z = Pb-free part.
2
2
2
2
2
2
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−25°C to +85°C
−25°C to +85°C
D04860-0-12/05(B)
Package Description
14-Lead Thin Shrink Small Outline Package [TSSOP]
14-Lead Thin Shrink Small Outline Package [TSSOP]
14-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
12-Ball Wafer Level Chip Scale Package [WLCSP]
12-Ball Wafer Level Chip Scale Package [WLCSP]
Rev. B | Page 20 of 20
Branding
SDC
SDC
1
Package
Option
RU-14
RU-14
RU-14
CP-20-1
CP-20-1
CB-12
CB-12