MCF51JF32VHS Freescale Semiconductor, MCF51JF32VHS Datasheet - Page 2

• Manufacturer Part Number: MCF51JF32VHS
• Description: 32-bit Microcontrollers - MCU COLDFIREV1 32kFLASH
• Manufacturer: Freescale Semiconductor

Specifications of MCF51JF32VHS

• Rohs: yes
• Core: ColdFire V1
• Processor Series: MCF51JF128
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 32 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: QFN-44
• Mounting Style: SMD/SMT

1 Ordering parts...........................................................................3
2 Part identification......................................................................3
3 Terminology and guidelines......................................................4
4 Ratings......................................................................................8
5 General.....................................................................................9
2
1.1 Determining valid orderable parts......................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................5
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............6
3.8 Definition: Typical value.....................................................7
4.1 Thermal handling ratings...................................................8
4.2 Moisture handling ratings..................................................8
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5.1 Typical Value Conditions...................................................9
5.2 Nonswitching electrical specifications...............................10
5.3 Switching electrical specifications.....................................18
5.4 Thermal specifications.......................................................20
requirements......................................................................6
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
5.3.1
Voltage and Current Operating Requirements......10
LVD and POR operating requirements.................11
Voltage and current operating behaviors..............12
Power mode transition operating behaviors..........12
Power consumption operating behaviors..............13
EMC radiated emissions operating behaviors.......17
Designing with radiated emissions in mind...........18
Capacitance attributes..........................................18
General Switching Specifications..........................18
MCF51JF128 Data Sheet, Rev. 6, 01/2012.
Table of Contents
6 Peripheral operating requirements and behaviors....................21
7 Dimensions...............................................................................54
8 Pinout........................................................................................55
9 Revision History........................................................................72
6.1 Core modules....................................................................21
6.2 System modules................................................................22
6.3 Clock modules...................................................................22
6.4 Memories and memory interfaces.....................................27
6.5 Security and integrity modules..........................................35
6.6 Analog...............................................................................36
6.7 Timers................................................................................45
6.8 Communication interfaces.................................................46
6.9 Human-machine interfaces (HMI)......................................53
7.1 Obtaining package dimensions.........................................54
8.1 Signal Multiplexing and Pin Assignments..........................55
8.2 Pinout diagrams.................................................................57
8.3 Module-by-module signals.................................................61
5.4.1
5.4.2
6.1.1
6.3.1
6.3.2
6.4.1
6.4.2
6.4.3
6.6.1
6.6.2
6.6.3
6.6.4
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.9.1
Thermal operating requirements...........................20
Thermal attributes.................................................21
Debug specifications.............................................21
MCG specifications...............................................22
Oscillator electrical specifications.........................24
Flash (FTFL) electrical specifications....................27
EzPort Switching Specifications............................31
Mini-Flexbus Switching Specifications..................32
ADC electrical specifications.................................36
CMP and 6-bit DAC electrical specifications.........38
12-bit DAC electrical characteristics.....................41
Voltage reference electrical specifications............44
USB electrical specifications.................................46
USB DCD electrical specifications........................46
USB VREG electrical specifications......................46
SPI switching specifications..................................47
I2S/SAI Switching Specifications..........................51
TSI electrical specifications...................................53
Freescale Semiconductor, Inc.