MK20DN512VLL10 Freescale Semiconductor, MK20DN512VLL10 Datasheet - Page 21

• Manufacturer Part Number: MK20DN512VLL10
• Description: ARM Microcontrollers - MCU Kinetis 512K
• Manufacturer: Freescale Semiconductor

Specifications of MK20DN512VLL10

• Rohs: yes
• Core: ARM Cortex M4
• Processor Series: MK20DN512
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 100 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 128 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-100
• Mounting Style: SMD/SMT
• A/d Bit Size: 16 bit
• A/d Channels Available: 2
• Interface Type: CAN, I2C, I2S, SPI, UART, USB
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2
• On-chip Dac: Yes
• Program Memory Type: Flash
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 1.71 V

1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
2. The greater synchronous and asynchronous timing must be met.
3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and
4. 75pF load
5. 15pF load
5.4 Thermal specifications
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
Freescale Semiconductor, Inc.
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
—
Board type
may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be
recognized in that case.
VLLSx modes.
Symbol
T
T
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
Table 11. Thermal operating requirements
K20 Sub-Family Data Sheet, Rev. 2, 12/2012.
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to board
Thermal
resistance, junction
to case
Description
Table continues on the next page...
47
35
37
29
20
9
100 LQFP
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Max.
125
105
1
1
1
1
2
3
Notes
Unit
°C
°C
General
21