MPC8308CZQAGDA Freescale Semiconductor, MPC8308CZQAGDA Datasheet - Page 75

• Manufacturer Part Number: MPC8308CZQAGDA
• Description: Microprocessors - MPU E300 EXT TEMP PB 400
• Manufacturer: Freescale Semiconductor

Specifications of MPC8308CZQAGDA

• Processor Series: MPC8308
• Core: e300
• Maximum Clock Frequency: 400 MHz
• Interface Type: I2C, JTAG, UART
• Operating Supply Voltage: 0.95 V to 1.05 V
• Maximum Operating Temperature: - 40 C to + 105 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-476

22.1
This table provides the package thermal characteristics for the 473, 19  19 mm MAPBGA.
22.2
For the following sections, P
22.2.1
An estimation of the chip junction temperature, T
where:
The junction-t-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
Freescale Semiconductor
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
T
T
R
P
A
J

D
Thermal Characteristics
Thermal Management Information
JA
= junction temperature (C)
= ambient temperature for the package (C)
= power dissipation in the package (W)
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
= junction-to-ambient thermal resistance (C/W)
T
Characteristic
J
= T
A
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
+ (R
Table 59. Package Thermal Characteristics for MAPBGA

JA
D
= (V
 P
D
DD
)

I
DD
) + P
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Natural Convection
I/O
Board Type
J
, can be obtained from the equation:
, where P
—
—
I/O
is the power dissipation of the I/O drivers.
Symbol
R
R
R
R
R
R

JMA
JMA
JC
JA
JA
JB
JT
Value
42
27
35
24
17
9
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Thermal
1, 2, 3
Note
1, 2
1, 3
1, 3
4
5
6
75