CAT24C64WI-GT3JN ON Semiconductor, CAT24C64WI-GT3JN Datasheet
![no-image](/images/manufacturer_photos/0/4/495/on_semiconductor_sml.jpg)
CAT24C64WI-GT3JN
Specifications of CAT24C64WI-GT3JN
Related parts for CAT24C64WI-GT3JN
CAT24C64WI-GT3JN Summary of contents
Page 1
... I C CMOS Serial EEPROM Description The CAT24C64 CMOS Serial EEPROM device, internally organized as 8192 words of 8 bits each. It features a 32−byte page write buffer and supports the Standard (100 kHz), Fast (400 kHz) and Fast−Plus (1 MHz) I External address pins make it possible to address up to eight CAT24C64 devices on the same bus ...
Page 2
Table 1. ABSOLUTE MAXIMUM RATINGS Parameters Storage Temperature Voltage on Any Pin with Respect to Ground (Note 1) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is ...
Page 3
Table 5. A.C. CHARACTERISTICS ( −40°C to +125°C and Symbol Parameter F Clock Frequency SCL t START Condition Hold Time HD:STA t Low Period of SCL Clock LOW t ...
Page 4
Power-On Reset (POR) Each CAT24C64 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after V exceeds the POR trigger level and will CC ...
Page 5
BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START t F SCL t SU:STA SDA IN SDA OUT WRITE OPERATIONS Byte Write To write data to memory, the Master creates a START condition ...
Page 6
S BUS ACTIVITY SLAVE R MASTER ADDRESS T S SLAVE *a − a are don’t care bits SCL SDA 8th Bit Byte n BUS ACTIVITY SLAVE ADDRESS MASTER R ADDRESS BYTE T S ...
Page 7
READ OPERATIONS Immediate Read To read data from memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to ‘1’. The Slave responds with ACK and starts shifting out ...
Page 8
E E1 TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-187. PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD−01 ISSUE O SYMBOL MIN A A1 ...
Page 9
PIN # 1 IDENTIFICATION D TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA−01 ISSUE A SYMBOL ...
Page 10
PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O SYMBOL ...
Page 11
PIN#1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with EIAJ EDR-7320. PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O SYMBOL ...
Page 12
E1 e TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O SYMBOL MIN A A1 0.05 A2 ...
Page 13
D E PIN #1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.45 0.50 A1 0.00 0.02 A3 0.127 REF b 0.20 0.25 D 1.95 2.00 D2 1.35 1.40 E 2.95 3.00 E2 1.25 1.30 e 0.50 REF L 0.25 ...
Page 14
D E PIN#1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.70 0.75 A1 0.00 0.02 A2 0.45 0.55 A3 0.20 REF b 0.20 0.25 D 1.90 2.00 D2 1.30 1.40 E 2.90 3.00 E2 1.20 1.30 e 0.50 TYP ...
Page 15
... The TDFN 0.75 mm (VP2) package is not recommended for new designs. Please replace with UDFN 0.5 mm (HU4). 17. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 18. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...