CAT24C64WI-G ON Semiconductor, CAT24C64WI-G Datasheet
CAT24C64WI-G
Specifications of CAT24C64WI-G
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CAT24C64WI-G Summary of contents
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... Supports Standard, Fast and Fast−Plus I • 1 5.5 V Supply Voltage Range • 32−Byte Page Write Buffer • Hardware Write Protection for Entire Memory • Schmitt Triggers and Noise Suppression Filters on I (SCL and SDA) • Low Power CMOS Technology • ...
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Table 1. ABSOLUTE MAXIMUM RATINGS Parameters Storage Temperature Voltage on Any Pin with Respect to Ground (Note 1) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is ...
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Table 5. A.C. CHARACTERISTICS ( −40°C to +125°C and Symbol Parameter F Clock Frequency SCL t START Condition Hold Time HD:STA t Low Period of SCL Clock LOW t ...
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Power-On Reset (POR) Each CAT24C64 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after V exceeds the POR trigger level and will CC ...
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... New data can therefore replace data loaded earlier. Following the STOP, data loaded during the Page Write session will be written to memory in a single internal Write cycle ( ...
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S BUS ACTIVITY SLAVE R MASTER ADDRESS T S SLAVE *a − a are don’t care bits SCL SDA 8th Bit Byte n BUS ACTIVITY SLAVE ADDRESS MASTER R ADDRESS BYTE T S ...
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... If, after receiving data sent by the Slave, the Master responds with ACK, then the Slave will continue transmitting until the Master responds with NoACK followed by STOP (Figure 12). During Sequential Read the internal byte address is automatically incremented up to the end of memory, where it then wraps around to the beginning of memory ...
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E E1 TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-187. PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD−01 ISSUE O SYMBOL MIN A A1 ...
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PIN # 1 IDENTIFICATION D TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA−01 ISSUE A SYMBOL ...
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PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O SYMBOL ...
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PIN#1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with EIAJ EDR-7320. PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O SYMBOL ...
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E1 e TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O SYMBOL MIN A A1 0.05 A2 ...
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D E PIN #1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.45 0.50 A1 0.00 0.02 A3 0.127 REF b 0.20 0.25 D 1.95 2.00 D2 1.35 1.40 E 2.95 3.00 E2 1.25 1.30 e 0.50 REF L 0.25 ...
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D E PIN#1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.70 0.75 A1 0.00 0.02 A2 0.45 0.55 A3 0.20 REF b 0.20 0.25 D 1.90 2.00 D2 1.30 1.40 E 2.90 3.00 E2 1.20 1.30 e 0.50 TYP ...
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... The TDFN 0.75 mm (VP2) package is not recommended for new designs. Please replace with UDFN 0.5 mm (HU4). 17. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 18. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...