iCE65L01F-TCB81I Lattice, iCE65L01F-TCB81I Datasheet - Page 3
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iCE65L01F-TCB81I
Manufacturer Part Number
iCE65L01F-TCB81I
Description
FPGA - Field Programmable Gate Array iCE65 1280 LUTs, 1.0 1.2V Ultra Low-Power
Manufacturer
Lattice
Datasheet
1.ICE65L04F-TCB196C.pdf
(110 pages)
Specifications of iCE65L01F-TCB81I
Rohs
yes
Number Of Gates
1280
Number Of Logic Blocks
16
Number Of I/os
63
Maximum Operating Frequency
256 MHz
Operating Supply Voltage
1.2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
CBGA-81
Distributed Ram
64 Kbit
Minimum Operating Temperature
- 40 C
Operating Supply Current
12 uA
Factory Pack Quantity
490
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ICE65L01F-TCB81I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Packaging Options
81-ball chip-scale BGA
84-pin quad flat no-lead package
100-pin very thin quad flat package
121-ball chip-scale BGA
132-ball chip-scale BGA
196-ball chip-scale BGA
284-ball chip-scale BGA
Known Good Die
The iCE65L04 and the iCE65L08 are both available in the CB196 package and have similar footprints but are not completely pin
compatible. See
Lattice Semiconductor Corporation
www.latticesemi.com
= Common footprint allows each density migration on the same printed circuit board.
iCE65 components are available in a variety of package options to support specific application requirements. The
available options, including the number of available user-programmable I/O pins (PIOs), are listed in Table 2. Fully-
tested Known-Good Die (KGD) DiePlus
iCE65 devices are provided exclusively in Pb-free, RoHS-compliant packages.
When iCE65 components are supplied in the same package style, devices of different gate densities share a common
footprint. The common footprint improves manufacturing flexibility. Different models of the same product can
share a common circuit board. Feature-rich versions of the end application mount a larger iCE65 device on the
circuit board. Low-end versions mount a smaller iCE65 device.
Package
“Pinout Differences between iCE65L04 and iCE65L08 in CB196
Table 2:
iCE65 Family Packaging Options, Maximum I/O per Package
See DiePlus
data sheet
Package
14 x 14
12 x 12
(mm)
Body
5 x 5
7 x 7
6 x 6
8 x 8
8 x 8
™
are available for die stacking and highly space-conscious applications. All
Package
VQ100
CB121
CB132
CB196
CB284
Code
QN84
CB81
DI
Ball/Lead
(mm)
Pitch
0.5
0.5
0.5
0.5
—
Package” on page
65L01
63
67
72
92
93
95
—
—
(0)
(0)
(0)
(0)
(0)
(0)
(Differential input count)
73
for more information.
65L04
150
176
176
95
72
—
—
—
(11)
(9)
(18)
(20)
(20)
(2.42, 30-MAR-2011)
.
65L08
150
222
222
95
—
—
—
—
(12)
(18)
(25)
(25)
3