STM8S103F3M6 STMicroelectronics, STM8S103F3M6 Datasheet - Page 90

• Manufacturer Part Number: STM8S103F3M6
• Description: 8-bit Microcontrollers - MCU 8-bit MCU Access 16 MHz 8kb Flash
• Manufacturer: STMicroelectronics

Specifications of STM8S103F3M6

• Product Category: 8-bit Microcontrollers - MCU
• Rohs: yes
• Core: STM8
• Data Bus Width: 8 bit

Electrical characteristics
10.3.11
10.3.11.1
10.3.11.2
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3. End point correlation line
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
While executing a simple application (toggling 2 LEDs through I/O ports), the product is
stressed by two electromagnetic events until a failure occurs (indicated by the LEDs).
•
•
A device reset allows normal operations to be resumed. The test results are given in the table
below based on the EMS levels and classes defined in application note AN1709 (EMC design
guide for STMicrocontrollers).
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
E
curves.
E
E
E
one.
E
point correlation line.
FESD: Functional electrostatic discharge (positive and negative) is applied on all pins of
the device until a functional disturbance occurs. This test conforms with the IEC 61000-4-2
standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100 pF capacitor, until a functional disturbance occurs. This test conforms with
the IEC 61000-4-4 standard.
T
O
G
D
L
= Integral linearity error: maximum deviation between any actual transition and the end
= Total unadjusted error: maximum deviation between the actual and the ideal transfer
= Differential linearity error: maximum deviation between actual steps and the ideal
= Offset error: deviation between the first actual transition and the first ideal one.
= Gain error: deviation between the last ideal transition and the last actual one.
V AIN
R AIN
C AIN
Figure 44: Typical application with ADC
DocID15441 Rev 9
AINx
V DD
V T
0.6 V
V T
0.6 V
STM8S103K3 STM8S103F3 STM8S103F2
I L
± 1 µA
conversion
10-bit A/D
STM8
C ADC
DD
and V
SS