STM8S103F3M6 STMicroelectronics, STM8S103F3M6 Datasheet - Page 96

• Manufacturer Part Number: STM8S103F3M6
• Description: 8-bit Microcontrollers - MCU 8-bit MCU Access 16 MHz 8kb Flash
• Manufacturer: STMicroelectronics

Specifications of STM8S103F3M6

• Product Category: 8-bit Microcontrollers - MCU
• Rohs: yes
• Core: STM8
• Data Bus Width: 8 bit

Package information
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32-lead UFQFPN package mechanical data
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
4. Dimensions are in millimeters.
Dim.
A
A1
A3
Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
life.
to connect and solder this backside pad to PCB ground.
Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
mm
Min
0.500
0
Typ
0.550
0.020
0.200
DocID15441 Rev 9
Max
0.600
0.050
STM8S103K3 STM8S103F3 STM8S103F2
inches
Min
0.0197
(1)
Typ
0.0217
0.0008
0.0079
AOB8_ME
Max
0.0236
0.0020