74HC244D-Q100,118 NXP Semiconductors, 74HC244D-Q100,118 Datasheet
74HC244D-Q100,118
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74HC244D-Q100,118 Summary of contents
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Octal buffer/line driver; 3-state Rev. 1 — 7 August 2012 1. General description The 74HC244-Q100; 74HCT244-Q100 is an 8-bit buffer/line driver with 3-state outputs. The device can be used as two 4-bit buffers or one 8-bit buffer. The ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range 40 C to +125 C 74HC244D-Q100 74HCT244D-Q100 40 C to +125 C 74HC244PW-Q100 74HCT244PW-Q100 40 C to +125 C 74HC244BQ-Q100 74HCT244BQ-Q100 4. Functional diagram Fig 1. Functional diagram 74HC_HCT244_Q100 Product data sheet 74HC244-Q100; 74HCT244-Q100 ...
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... NXP Semiconductors 2 18 1A0 2A0 1Y0 4 16 1A1 2A1 1Y1 6 14 1A2 2A2 1Y2 8 12 1A3 1Y3 2A3 1 1OE 2OE Fig 2. Logic symbol 5. Pinning information 5.1 Pinning +&$4 +&7$4 2( $ < $ < $ < $ < *1' Fig 4. Pin configuration SO20, TSSOP20 74HC_HCT244_Q100 Product data sheet 74HC244-Q100; 74HCT244-Q100 ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin 1OE, 2OE 1, 19 1A0, 1A1, 1A2, 1A3 2Y0, 2Y1, 2Y2, 2Y3 GND 10 2A0, 2A1, 2A2, 2A3 17, 15, 13, 11 1Y0, 1Y1, 1Y2, 1Y3 18, 16, 14 Functional description [1] Table 3 ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter 74HC244-Q100 V supply voltage CC V input voltage I V output voltage O t/V input transition rise and fall rate V T ambient temperature amb 74HCT244-Q100 V supply voltage CC V input voltage I V output voltage O ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V LOW-level output voltage = 20 6.0 mA 7.8 mA input leakage current ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for load circuit see Figure Symbol Parameter Conditions 74HC244-Q100 t propagation delay nAn to nYn; pd see enable time nOE to nYn; see disable time nOE to nYn or see dis transition time ...
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... NXP Semiconductors Table 7. Dynamic characteristics GND = 0 V; for load circuit see Figure Symbol Parameter Conditions 74HCT244-Q100 t propagation delay nAn to nYn; pd see enable time nOE to nYn Figure 7 t disable time nOE to nYn; V dis Figure 7 t transition time power dissipation per buffer ...
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... NXP Semiconductors nOE input nYn output LOW-to-OFF OFF-to-LOW nYn output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. 3-state enable and disable times Table 8. ...
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... NXP Semiconductors negative Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 8. Test circuit for measuring switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic MIL Military 14. Revision history Table 11. Revision history Document ID Release date 74HC_HCT244_Q100 v.1 20120807 74HC_HCT244_Q100 Product data sheet 74HC244-Q100 ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Abbreviations ...