74LVC1G17GV-G NXP Semiconductors, 74LVC1G17GV-G Datasheet
74LVC1G17GV-G
Specifications of 74LVC1G17GV-G
Related parts for 74LVC1G17GV-G
74LVC1G17GV-G Summary of contents
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Single Schmitt trigger buffer Rev. 10 — 29 June 2012 1. General description The 74LVC1G17 provides a buffer function with Schmitt trigger input capable of transforming slowly changing input signals into sharply defined outputs. The input can ...
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... Marking Table 2. Marking codes Type number 74LVC1G17GW 74LVC1G17GV 74LVC1G17GM 74LVC1G17GF 74LVC1G17GN 74LVC1G17GS 74LVC1G17GX [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram A 2 Fig 1 ...
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... NXP Semiconductors Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74LVC1G17 n. GND 3 001aaf190 Fig 4. Pin configuration SOT353-1 and SOT753 74LVC1G17 n. GND 3 Transparent top view Fig 6. Pin configuration SOT891, SOT1115 and SOT1202 6.2 Pin description Table 3. Pin description Symbol Pin TSSOP5 and X2SON5 n ...
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... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter = 40 C to +85 C T amb V HIGH-level output voltage LOW-level output voltage input leakage current I I power-off leakage current V OFF I supply current CC ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter I power-off leakage current V OFF I supply current CC I additional supply current CC [1] All typical values are measured at maximum V Table 8. Transfer characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 10.1 Transfer characteristic waveforms T− Fig 8. Transfer characteristic Fig 10. Typical transfer characteristics 74LVC1G17 Product data sheet mnb154 Fig (mA All information provided in this document is subject to legal disclaimers. Rev. 10 — 29 June 2012 ...
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... NXP Semiconductors 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t propagation delay pd C power dissipation PD capacitance [1] Typical values are measured the same as t and PLH PHL [ used to determine the dynamic power dissipation (P PD ...
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... NXP Semiconductors Table 10. Measurement points Supply voltage V CC 2 3 5.5 V Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. ...
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... NXP Semiconductors Linear change of V between 0 2 (1) Positive-going edge. (2) Negative-going edge. Fig 13. Average supply current as a function of supply voltage 74LVC1G17 Product data sheet (mA All information provided in this document is subject to legal disclaimers. Rev. 10 — 29 June 2012 ...
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... NXP Semiconductors 14. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 Fig 15. Package outline SOT753 (SC-74A) 74LVC1G17 Product data sheet scale ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. (2) terminal 1 index area Dimensions (mm are the original dimensions) (1) Unit max 0.5 0.04 0.25 1.50 mm nom 0.20 1.45 min 0.17 1.40 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. Outline version ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 17. Package outline SOT891 (XSON6) ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1115 Fig 18. Package outline SOT1115 (XSON6) ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1202 Fig 19. Package outline SOT1202 (XSON6) ...
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... NXP Semiconductors X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0 terminal 1 index area e 1 terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.128 0.85 mm nom 0.80 min 0.040 0.75 Note 1. Dimension A is including plating thickness. 2. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 15. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 16. Revision history Table 13. Revision history Document ID Release date 74LVC1G17 v.10 20120629 • Modifications: Added type number 74LVC1G17GX (SOT1226) • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics 10.1 Transfer characteristic waveforms . . . . . . . . . . 7 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 Waveforms ...