93LC66A/SN Microchip Technology, 93LC66A/SN Datasheet
93LC66A/SN
Specifications of 93LC66A/SN
Related parts for 93LC66A/SN
93LC66A/SN Summary of contents
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... I, E Yes 8 or 16-bit I, E Description: The Microchip Technology Inc. 93XX66A/B/C devices are 4K bit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA66C, 93LC66C or 93C66C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX66A devices are available, while the 93XX66B devices provide dedicated 16-bit communication ...
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... Package Types (not to scale) ROTATED SOIC PDIP/SOIC (ex: 93LC46BX ORG CLK CLK TSSOP/MSOP SOT-23 (ST, MS) (OT CLK ORG DFN CLK 6 ORG ORG pin A/B devices DS21795C-page 2 (P, SN ORG * CLK © 2005 Microchip Technology Inc. ...
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... Note 1: This parameter is periodically sampled and not 100% tested. 2: ORG pin not available on ‘A’ or ‘B’ versions. 3: Ready/Busy status must be cleared from DO, see Section 3.4 "Data Out (DO)". © 2005 Microchip Technology Inc. Industrial (I -40°C to +85° Automotive (E -40°C to +125°C, V ...
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... Erase/Write mode (93C versions) — ERAL mode, 4.5V — WRAL mode, 4.5V 1M — cycles 25°C, V © 2005 Microchip Technology Inc. = +1.8V to +5. +2.5V to +5.5V CC Conditions < 5.5V, 93XX66C only CC < 5.5V CC < 2.5V CC < 5.5V, 93XX66C only CC < 5.5V CC < 2.5V CC < ...
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... TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX66A OR 93XX66C WITH ORG = 0) Instruction SB Opcode ERASE 1 00 ERAL EWDS EWEN READ WRITE 1 00 WRAL 1 0 © 2005 Microchip Technology Inc. T CKH T CKL T DIH T PD Status Valid Address Data In — — — — ...
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... ERASE or WRITE instruction can be executed. Block Diagram V CC Memory Array Data Register DI Mode Decode ORG* Logic CS Clock CLK Register *ORG input is not available on A/B devices is below Address Decoder Address Counter DO Output Buffer © 2005 Microchip Technology Inc. ...
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... High-Z DO © 2005 Microchip Technology Inc. The DO pin indicates the Ready/Busy status of the device brought high after a minimum of 250 ns low ( logical ‘0’ indicates that programming CSL is still in progress logical ‘1’ indicates that the register at the specified address has been erased and the device is ready for another instruction ...
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... Issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. V must CSL ••• CSL ••• 4.5V for proper operation of ERAL. Check Status Busy Ready High Check Status Busy Ready High-Z EC © 2005 Microchip Technology Inc. ...
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... High-Z DO © 2005 Microchip Technology Inc. To protect against accidental data disturbance, the EWDS instruction can be used to disable all erase/write functions and should follow all programming opera- tions. Execution of a READ instruction is independent of both the EWEN and EWDS instructions. ••• ...
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... Note: Issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. T CSL ••• ••• Busy CSL ••• ••• D0 Busy Ready High Ready High-Z © 2005 Microchip Technology Inc. ...
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... WRAL TIMING FOR 93C DEVICES CS CLK High-Z DO © 2005 Microchip Technology Inc. The DO pin indicates the Ready/Busy status of the device brought high after a minimum of 250 ns low (T ). CSL Note: Issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. V must be 4 ...
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... V organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX66A devices are always x8 organization and 93XX66B devices are always x16 organization. Function after the posi Logic HI, the CC or Logic LO, the (x8) memory SS © 2005 Microchip Technology Inc. ...
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... XXNN 8-Lead PDIP XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN © 2005 Microchip Technology Inc. Example: 3L66BI 5281L7 Example: 3EL7 Example: 93LC66B I/P 1L7 e 3 0528 Example: 93LC66BI SN e 0528 ...
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... DFN E Temp. — — — 365 375 385 368 378 388 © 2005 Microchip Technology Inc. ...
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... Mold Draft Angle Top Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111 © 2005 Microchip Technology Inc Units INCHES ...
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... B .014 .017 .020 MILLIMETERS MIN NOM MAX 6 0.95 1.90 0.90 1.18 1.45 0.90 1.10 1.30 0.00 0.08 0.15 2.60 2.80 3.00 1.50 1.63 1.75 2.80 2.95 3.10 0.35 0.45 0. 0.09 0.15 0.20 0.35 0.43 0. © 2005 Microchip Technology Inc. ...
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... Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 © 2005 Microchip Technology Inc ...
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... A2 MILLIMETERS MIN NOM MAX 8 1.27 1.35 1.55 1.75 1.32 1.42 1.55 0.10 0.18 0.25 5.79 6.02 6.20 3.71 3.91 3.99 4.80 4.90 5.00 0.25 0.38 0.51 0.48 0.62 0. 0.20 0.23 0.25 0.33 0.42 0. © 2005 Microchip Technology Inc. ...
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... Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 © 2005 Microchip Technology Inc Units ...
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... L .012 .016 .020 MILLIMETERS* MIN NOM MAX 8 0.50 BSC 0.80 0.90 1.00 0.00 0.02 0.05 0.20 REF. 2.00 BSC 1.39 -- 1.62 3.00 BSC 1.20 -- 1.80 0.20 0.25 0.30 0.30 0.40 0.50 Revised 05/24/04 © 2005 Microchip Technology Inc. ...
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... APPENDIX A: REVISION HISTORY Revision B Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision C Added DFN package. © 2005 Microchip Technology Inc. DS21795C-page 21 ...
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... NOTES: DS21795C-page 22 © 2005 Microchip Technology Inc. ...
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... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2005 Microchip Technology Inc. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...
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... What deletions from the document could be made without affecting the overall usefulness there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21795C-page 24 Total Pages Sent ________ FAX: (______) _________ - _________ N Literature Number: DS21795C © 2005 Microchip Technology Inc. ...
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... The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2003 Microchip Technology Inc. /XX X Examples: ...
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... NOTES: DS21795C-page 26 © 2003 Microchip Technology Inc. ...
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... PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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