MR4A16BYS35 Everspin Technologies, MR4A16BYS35 Datasheet

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MR4A16BYS35

Manufacturer Part Number
MR4A16BYS35
Description
NVRAM 16MB 3.3V 35ns 1Mx16 Parallel MRAM
Manufacturer
Everspin Technologies
Datasheet

Specifications of MR4A16BYS35

Rohs
yes
Data Bus Width
16 bit
Memory Size
16 Mbit
Organization
1 M x 16
Interface Type
Parallel
Access Time
35 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
3 V
Operating Current
110 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Package / Case
TSOP-54
Mounting Style
SMD/SMT

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Copyright © Everspin Technologies 2012
FEATURES
BENEFITS
INTRODUCTION
CONTENTS
The MR4A16B is a 16,777,216-bit magnetoresistive random access memory
(MRAM) device organized as 1,048,576 words of 16 bits. The MR4A16B offers
SRAM compatible 35 ns read/write timing with unlimited endurance. Data
is always non-volatile for greater than 20 years. Data is automatically pro-
tected on power loss by low-voltage inhibit circuitry to prevent writes with
voltage out of specification. To simplify fault tolerant design, the MR4A16B includes internal single bit
error correction code with 7 ECC parity bits for every 64 data bits. The MR4A16B is the ideal memory solu-
tion for applications that must permanently store and retrieve critical data and programs quickly.
The MR4A16B is available in a small footprint 48-pin ball grid array (BGA) package and a 54-pin thin small
outline package (TSOP Type 2). These packages are compatible with similar low-power SRAM products
and other nonvolatile RAM products.
The MR4A16B provides highly reliable data storage over a wide range of temperatures. The product is
offered with commercial temperature (0 to +70 °C), industrial temperature (-40 to +85 °C), and AEC-Q100
Grade 1 (-40 to +125 °C) temperature range options.
• +3.3 Volt power supply
• Fast 35 ns read/write cycle
• SRAM compatible timing
• Unlimited read & write endurance
• Data always non-volatile for >20 years at temperature
• RoHS-compliant small footprint BGA and TSOP2 package
• AEC-Q100 Grade 1 option in TSOP2 package.
• One memory replaces FLASH, SRAM, EEPROM and BBSRAM in systems
• Improves reliability by replacing battery-backed SRAM
1. DEVICE PIN ASSIGNMENT.........................................................................
2. ELECTRICAL SPECIFICATIONS.................................................................
3. TIMING SPECIFICATIONS..........................................................................
4. ORDERING INFORMATION.......................................................................
5. MECHANICAL DRAWING..........................................................................
6. REVISION HISTORY......................................................................................
How to Reach Us...................................................................................... ..........
for simpler, more efficient designs
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3
4
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12
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MR4A16B Rev. 8 8/2012
MR4A16B
RoHS
1M x 16 MRAM

Related parts for MR4A16BYS35

MR4A16BYS35 Summary of contents

Page 1

... AEC-Q100 Grade 1 (-40 to +125 °C) temperature range options. CONTENTS 1. DEVICE PIN ASSIGNMENT......................................................................... 2. ELECTRICAL SPECIFICATIONS................................................................. 3. TIMING SPECIFICATIONS.......................................................................... 4. ORDERING INFORMATION....................................................................... 5. MECHANICAL DRAWING.......................................................................... 6. REVISION HISTORY...................................................................................... How to Reach Us...................................................................................... .......... Copyright © Everspin Technologies 2012 MR4A16B RoHS MR4A16B Rev ...

Page 2

... Upper Byte Enable LB Lower Byte Enable DQ Data I/O V Power Supply DD V Ground Not Connect NC No Connection Copyright © Everspin Technologies 2012 Figure 1.1 Block Diagram UPPER BYTE OUTPUT ENABLE LOWER BYTE OUTPUT ENABLE ROW COLUMN DECODER DECODER SENSE AMPS BIT MEMORY ARRAY ...

Page 3

... high low don’t care 1 Hi-Z = high impedance 2 Copyright © Everspin Technologies 2012 DQL0 A6 C DQL1 DQL2 DQL3 DD E A16 V DQL4 SS F A15 DQL5 ...

Page 4

... All voltages are referenced 0.5V. The AC value of V must not exceed applied V IN 20mA. Power dissipation capability depends on package characteristics and use environment. 3 Copyright © Everspin Technologies 2012 Table 2.1 Absolute Maximum Ratings Conditions Commercial Industrial AEC-Q100 Grade 1 ...

Page 5

... STARTUP READ/WRITE INHIBITED Copyright © Everspin Technologies 2012 Table 2.2 Operating Conditions Temp Range Commercial Industrial AEC-Q100 Grade 1 (min). See Power Up and Power Down Sequencing below. exceeds V DD DD, + 2.0 V (pulse width ≤ 10 ns) for I ≤ 20.0 mA (pulse width ≤ ...

Page 6

... CMOS standby current I (E ≥ 0.2 V and V SB2 max MHz) DD All active current measurements are measured with one address transition per cycle and at minimum cycle time. 1 Copyright © Everspin Technologies 2012 Table 2.3 DC Characteristics Conditions All All +100 μA OL ...

Page 7

... Logic input pulse levels Input rise/fall time Output load for low and high impedance parameters Output load for all other timing parameters Output Copyright © Everspin Technologies 2012 Table 3.1 Capacitance Table 3.2 AC Measurement Conditions Figure 3.1 Output Load Test Low and High Figure 3 ...

Page 8

... This parameter is sampled and not 100% tested. Transition is measured ±200 mV from the steady-state voltage (ADDRESS) Previous Data Valid Q (DATA OUT) Note: Device is continuously selected (E≤V A (ADDRESS) E (CHIP ENABLE) G (OUTPUT ENABLE) LB, UB (BYTE ENABLE) Q (DATA OUT) Copyright © Everspin Technologies 2012 Table 3.3 Read Cycle Timing Figure 3.3A Read Cycle 1 t ...

Page 9

... This parameter is sampled and not 100% tested. Transition is measured ±200 mV from the steady-state voltage. At any given 3 voltage or temperate, t (max) < t WLQZ A (ADDRESS) E (CHIP ENABLE) W (WRITE ENABLE) UB, LB (BYTE ENABLED) D (DATA IN) Q (DATA OUT) Copyright © Everspin Technologies 2012 Table 3.4 Write Cycle Timing 1 (W Controlled high) G low) G high) G low) ...

Page 10

... W goes high, the output will remain in a high-impedance state. A (ADDRESS) E (CHIP ENABLE) W (WRITE ENABLE) UB, LB (BYTE ENABLE) D (DATA IN) Q (DATA OUT) Copyright © Everspin Technologies 2012 Table 3.5 Write Cycle Timing 2 (E Controlled Figure 3.5 Write Cycle Timing 2 (E Controlled) t AVAV ...

Page 11

... All write cycle timings are referenced from the last valid address to the first transition address. 2 Figure 3.6 Write Cycle Timing 3 (LB/UB Controlled) A (ADDRESS) E (CHIP ENABLE) W (WRITE ENABLE) UB, LB (BYTE ENABLED) D (DATA IN) Q (DATA OUT) Copyright © Everspin Technologies 2012 2 t AVAV t AVEH t AVBL Hi -Z ...

Page 12

... Blank= Commercial (0 to +70 °C, C= Industrial (-40 to +85°C, M= AEC-Q100 Grade 1 (-40 to +125 °C) Revision Data Width 16 = 16-bit Type A = Asynchronous Density 4 =16Mb Magnetoresistive RAM Order Part Number MR4A16BMA35 1 MR4A16BMA35R MR4A16BYS35 MR4A16BYS35R MR4A16BCMA35 MR4A16BCMA35R MR4A16CBYS35 MR4A16BCYS35R MR4A16BMYS35 Preliminary MR4A16BMYS35R MR4A16B Rev. 8 8/2012 Preliminary ...

Page 13

... A 1.19 A1 0.22 b 0.31 D 10.00 BSC E 10.00 BSC D1 5.25 BSC E1 3.75 BSC DE 0.375 BSC SE 0.375 BSC e 0.75 BSC Ref Tolerance of, from and position aaa bbb ddd eee fff Copyright © Everspin Technologies 2012 Figure 5.1 48-FBGA PIN A1 INDEX SEATING PLANE ø 0.35mm Max 1.27 1.35 0.27 0.32 1. 0.36 0. ...

Page 14

... MECHANICAL DRAWING 0.71 REF. C SEATING PLANE Ref Min Nominal A A1 0.05 A2 0.95 b 0.30 c 0.12 D 22.10 E 11.56 E1 10.03 e 0.80 BSC L 0.40 L1 0.80 REF R1 0.12 R2 0.12 θ 0° θ1 0.40 θ2 θ3 Copyright © Everspin Technologies 2012 Figure 5.2 54-TSOP2 ⊕0.20(0.008 0.10 C Max 1.20 0.10 0.15 1.00 1.05 0.35 0.45 0.21 22.22 22.35 11.76 11.95 10.16 10.29 0.50 0. 0.25 - 8° 15° REF 15° REF 14 MR4A16B θ ...

Page 15

... All operating parameters including “Typicals” must be validated for each customer application by customer’s technical experts. Everspin Technologies does not convey any license under its patent rights nor the rights of others. Everspin Technologies products are not designed, intended, or authorized for use as components in systems intended for surgical im- ...

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