AT24C08B-PU Atmel, AT24C08B-PU Datasheet - Page 14

IC EEPROM 8KBIT 1MHZ 8DIP

AT24C08B-PU

Manufacturer Part Number
AT24C08B-PU
Description
IC EEPROM 8KBIT 1MHZ 8DIP
Manufacturer
Atmel
Datasheets

Specifications of AT24C08B-PU

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
8K (1K x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Organization
1 K x 8
Interface Type
2-Wire
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Memory Configuration
1024 X 8
Clock Frequency
1MHz
Supply Voltage Range
1.8V To 5.5V
Memory Case Style
DIP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C08B-PU
Manufacturer:
ATMEL
Quantity:
48
Part Number:
AT24C08B-PU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
AT24C08B Ordering Information
Notes:
14
Ordering Code
AT24C08B-PU (Bulk form only)
AT24C08BN-SH-B
AT24C08BN-SH-T
AT24C08B-TH-B
AT24C08B-TH-T
AT24C08BY6-YH-T
AT24C08B-TSU-T
AT24C08BU3-UU-T
AT24C08B-W-11
8P3
8S1
8A2
8Y6
5TS1
8U3-1
–1.8
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
AT24C04B/08B
Please contact Serial Interface Marketing.
(2)
(3)
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 5.5V)
(1)
(2)
(1)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Voltage
Options
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
Die Sale
8U3-1
5TS1
8P3
8S1
8S1
8A2
8A2
8Y6
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
5226A–SEEPR–06/07

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