25LC040-I/SN Microchip Technology, 25LC040-I/SN Datasheet - Page 15

• Manufacturer Part Number: 25LC040-I/SN
• Description: IC EEPROM 4KBIT 2MHZ 8SOIC
• Manufacturer: Microchip Technology

Specifications of 25LC040-I/SN

• Memory Size: 4K (512 x 8)
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Organization: 512 x 8
• Interface Type: SPI
• Maximum Clock Frequency: 2 MHz
• Access Time: 230 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V
• Package: 8SOIC N
• Density: 4 Kb
• Maximum Operating Frequency: 2 MHz
• Maximum Random Access Time: 230 ns
• Typical Operating Supply Voltage: 3.3|5 V
• Data Retention: 200(Min) Year
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
© 2006 Microchip Technology Inc.
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Drawing No. C04-086
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
b
e
.005" (0.127mm) per side.
See ASME Y14.5M
See ASME Y14.5M
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
n
e
L
c
b
MIN
L
25AA040/25LC040/25C040
.031
.002
.169
.018
.004
.007
.114
0°
–
Note:
INCHES
.026 BSC
.252 BSC
12° REF
12° REF
NOM
2
1
.039
.173
.024
.118
D
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8
–
–
–
–
–
MAX
.047
.041
.006
.177
.122
.030
.008
.012
8°
A1
A
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
MILLIMETERS*
6.40 BSC
0.65 BSC
12° REF
12° REF
NOM
1.00
4.40
3.00
0.60
Revised 7-25-06
8
–
–
–
–
–
DS21204E-page 15
MAX
A2
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°