25AA512-I/SM Microchip Technology, 25AA512-I/SM Datasheet - Page 30

• Manufacturer Part Number: 25AA512-I/SM
• Description: IC EEPROM 512KBIT 20MHZ 8SOIC
• Manufacturer: Microchip Technology

Specifications of 25AA512-I/SM

• Memory Size: 512K (64K x 8)
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 20MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Organization: 64 K x 8
• Interface Type: SPI
• Maximum Clock Frequency: 20 MHz
• Access Time: 250 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 7 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 1.8 V, 5.5 V
• Memory Configuration: 64K X 8
• Ic Interface Type: SPI
• Clock Frequency: 20MHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: SOIJ
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

25AA512
APPENDIX A:
REVISION HISTORY
Revision A
Original release.
Revision B (06/2007)
Revised Device Selection Table; Revised Features
section; Revised Table 1-1 DC Characteristics;
Revised Table 1-2 AC Characteristics; Replaced Pack-
age Drawings (Rev. AP); Revised Package Marking
(SOIC, SOIJ); Revised Product ID section.
Revision C (10/2007)
Removed 25LC512 part number; New data sheet
created for 25LC512 (DS22065); Revised Tables;
Updates throughout.
Revision D (03/2008)
Revise Figures 2-11 and 2-12; Revise title to Figure
2-13; Update Package Drawings.
Revision E (5/2008)
Modified parameter D006 in Table 1-1; Revised
Package Marking Information; Replaced Package
Drawings; Revised Product ID section.
Revision F (05/10)
Revised Table 1-2, Param. No. 25 Conditions;
Revised Section 2.2, added note; Added SOIC Land
Pattern and updated SOIJ package drawings.
 2010 Microchip Technology Inc.
DS22021F-page 30