NCP337FCT2G ON Semiconductor, NCP337FCT2G Datasheet
NCP337FCT2G
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NCP337FCT2G Summary of contents
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NCP336, NCP337 3 A Ultra-Small Controlled Load Switch with Auto-Discharge Path Description The NCP336 and NCP337 are very low Ron MOSFET controlled by external logic pin, allowing optimization of battery life, and portable device autonomy. Indeed, thanks to a current ...
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... Load−switch input voltage; connect greater ceramic capacitor from IN to GND as close as possible to the IC. Ground connection. Enable input, logic high turns on power switch. Load−switch output; connect ceramic capacitor from OUT to GND as close as possible to the IC is recommended. Figure 2. Block Diagram http://onsemi ...
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Table 2. MAXIMUM RATINGS Rating IN, OUT, EN, Pins: (Note 1) From IN to OUT Pins: Input/Output (Note 1) Maximum Junction Temperature Storage Temperature Range Moisture Sensitivity (Note 2) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are ...
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... Table 4. ELECTRICAL CHARACTERISTIC (Unless otherwise noted). Typical values are referenced to T Symbol Parameter POWER SWITCH R Static drain−source DSON on−state resistance Rdis Output discharge path V High−level input voltage IH V Low−level input voltage pull down resistor pd QUIESCENT CURRENT Istd ...
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TYPICAL CHARACTERISTICS Figure 4. Rdson (mW) vs. Vin (V) Figure 6. Rdson (mW) vs. Temperature (5C) at 100 mA Figure 5. Rdson (mW) vs. Iload (A) Figure 7. Rdson (mW) vs. Temperature (5C http://onsemi.com 5 ...
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TYPICAL CHARACTERISTICS Figure 8. Standby (mA) and Leakage Current (mA) vs. Vin (V) Figure 10. Leakage Current (mA) vs. Temperature (5C) Figure 9. Standby Current (mA) vs. Temperature (5C) Figure 11. Quiescent Current (mA) vs. Temperature (5C) http://onsemi.com 6 ...
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Overview The NCP337 is a high side P channel MOSFET power distribution switch designed to isolate ICs connected on the battery in order to save energy. The part can be turned on, with a wide range of battery from 1.2 ...
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... Taking into account of R obtain with: q • 1 oz, 2 layers: 100°C/W. ORDERING INFORMATION Device Marking NCP337FCT2G AC NCP336FCT2G AF †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. APPLICATION INFORMATION • ...
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... PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...