MCIMX6U6AVM08ABR Freescale Semiconductor, MCIMX6U6AVM08ABR Datasheet - Page 66
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MCIMX6U6AVM08ABR
Manufacturer Part Number
MCIMX6U6AVM08ABR
Description
Processors - Application Specialized i.MX6 DualLite
Manufacturer
Freescale Semiconductor
Type
Multimedia Applicationsr
Datasheet
1.MCIMX6S6AVM08ABR.pdf
(174 pages)
Specifications of MCIMX6U6AVM08ABR
Rohs
yes
Core
ARM Cortex A9
Processor Series
i.MX6
Data Bus Width
32 bit
Maximum Clock Frequency
800 MHz
Data Ram Size
16 KB
Operating Supply Voltage
1.175 V to 1.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-624
Interface Type
Parallel
Memory Type
L1/L2 Cache, ROM, SRAM
Minimum Operating Temperature
- 40 C
Number Of Timers
2
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Electrical Characteristics
Figure 28
1
2
3
66
To receive the reported setup and hold values, write calibration should be performed in order to locate the DQS in the middle
of DQ window.
All measurements are in reference to Vref level.
Measurements were done using balanced load and 25 Ω resistor from outputs to VDD_REF.
LP17
LP18
LP21
LP22
LP23
ID
DQM (output)
shows the write timing parameters. The timing parameters for this diagram appear in
DQS (output)
DQ and DQM setup time to DQS (differential strobe)
DQ and DQM hold time to DQS (differential strobe)
DQS latching rising transitions to associated clock edges
DQS high level width
DQS low level width
DQ (output)
CK_B
i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors, Rev. 1
CK
LP17
LP21
LP17
Parameter
Figure 28. LPDDR2 Write Cycle
Table 49. LPDDR2 Write Cycle
Data
DM
LP18
LP18
Data
DM
LP17
LP17
Data
DM
LP22
Data
DM
LP23
LP18
LP18
Data
DM
Symbol
t
t
t
DQSS
DQSH
DQSL
t
t
DS
DH
Data
DM
CK = 400 MHz
-0.25
Min
375
375
Freescale Semiconductor
0.4
0.4
Data
DM
+0.25
Data
DM
Max
—
—
-
-
Table
Unit
tCK
tCK
tCK
ps
ps
49.
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