M24C01-RMN6TP STMicroelectronics, M24C01-RMN6TP Datasheet - Page 37

• Manufacturer Part Number: M24C01-RMN6TP
• Description: IC EEPROM 1KBIT 400KHZ 8SOIC
• Manufacturer: STMicroelectronics

Specifications of M24C01-RMN6TP

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 128 K x 8
• Interface Type: I2C
• Maximum Clock Frequency: 0.4 MHz
• Access Time: 900 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 6.5 V
• Density: 1Kb
• Access Time (max): 900ns
• Frequency (max): 400KHz
• Write Protection: Yes
• Data Retention: 40Year
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: SOIC N
• Operating Temp Range: -40C to 85C
• Supply Current: 0.8mA
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8629-2; M24C01-RMN6TP

M24C16, M24C08, M24C04, M24C02, M24C01
29-Apr-2010
15-Apr-2011
Date
Version
16
17
Deleted TSSOP8 3x3 mm package from cover page.
Deleted Figure and Table relating to TSSOP8 3x3 mm package
information.
Deleted line and note in
TSSOP8 3x3 mm package.
In
temperature grade)
to 5 and deleted line concerning TSSOP8 3x3 mm package.
In
temperature grade)
to 5.
In
temperature grade)
Updated:
- Text modified in
- Text modified in
- V
-
no lead 2 x 3 mm,
- E2 (Rev MC): “ddd” has been changed to “eee” and its values modified in
Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no
lead 2 x 3 mm,
Added:
- Note at the end of the
- Figure footnote below the
(top view, marking side, with balls on the
Figure 15: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package
Table 26: Available M24C08 products (package, voltage range,
Table 27: Available M24C04 products (package, voltage range,
Table 28: Available M24C02 products (package, voltage range,
ESD
minimum value deleted
Doc ID 5067 Rev 17
data.
Section 2.3: Chip Enable (E0, E1,
Section 3.6: Write
outline.
updated UFDFPN8 (MC) package for M24C08-F range
updated UFDFPN8 (MC) package for M24C08-F range
updated UFDRPN8 options to MB or MC.
Table 24: Ordering information scheme
Section 1:
Figure 3: WLCSP and thin WLCSP connections
ofTable 5: Absolute maximum
Changes
Description.
operations.
underside).
E2).
Revision history
ratings.
concerning
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